Fabrication and Characterization of C60-Based Organic Schottky Diodes
CHENG Xiao-Man1,2,3,4, HU Zi-Yang1,2,3, WU Ren-Lei1,2,3, WANG Zhong-Qiang1,2,3, YIN Shou-Gen1,2,3
1Institute of Material Physics, Tianjin University of Technology, Tianjin 3003842Key Laboratory of Display Material and Photoelectric Devices (Ministry of Education), Tianjin University of Technology, Tianjin 3003843Tianjin key Laboratory of Photoelectric Materials and Device, Tianjin 3003844School of Science, Tianjin University of Technology, Tianjin 300384
Fabrication and Characterization of C60-Based Organic Schottky Diodes
CHENG Xiao-Man1,2,3,4, HU Zi-Yang1,2,3, WU Ren-Lei1,2,3, WANG Zhong-Qiang1,2,3, YIN Shou-Gen1,2,3
1Institute of Material Physics, Tianjin University of Technology, Tianjin 3003842Key Laboratory of Display Material and Photoelectric Devices (Ministry of Education), Tianjin University of Technology, Tianjin 3003843Tianjin key Laboratory of Photoelectric Materials and Device, Tianjin 3003844School of Science, Tianjin University of Technology, Tianjin 300384
摘要We have fabricated organic Schottky barrier diodes with Cu/LiF/C60/Al andwiched construction. Cu and Al are selected as the cathode and the anode, respectively. C60 is used as the organic layer and LiF as the buffer layer inserted between the cathode and C60. After the annealing process, Schottky contact is well formed at the Al/C60 interface and Ohmic contact is formed at the (Cu/LiF)/C60 interface. The current density-voltage (J-V) measurements of the diodes present nonlinear behavior. As a result, the rectification ratio reaches 1×03. The characteristics of the diodes have been analyzed using the energy band diagram. The values of Schottky barrier height ΦB, ideality factor n and reverse saturation current density Js are extracted according to the standard thermionic emission model.
Abstract:We have fabricated organic Schottky barrier diodes with Cu/LiF/C60/Al andwiched construction. Cu and Al are selected as the cathode and the anode, respectively. C60 is used as the organic layer and LiF as the buffer layer inserted between the cathode and C60. After the annealing process, Schottky contact is well formed at the Al/C60 interface and Ohmic contact is formed at the (Cu/LiF)/C60 interface. The current density-voltage (J-V) measurements of the diodes present nonlinear behavior. As a result, the rectification ratio reaches 1×03. The characteristics of the diodes have been analyzed using the energy band diagram. The values of Schottky barrier height ΦB, ideality factor n and reverse saturation current density Js are extracted according to the standard thermionic emission model.
[1] Sze SM 1981 Physics of Semiconductor Devices (New York: Wiley) [2] Tyagi M S 1991 Introduction to Semiconductor Materials and Devices (NewYork: John Wiley) [3] G\"{uler G, G\"{ull\"{u \"{O, Karatas S, Bakkalo\u{glu \"{O F 2009 Chin. Phys. Lett. 26 067301 [4] An X, Fan C H, Huang R, Zhang X 2009 Chin. Phys. Lett. 26 087304 [5] K{\ihco\u{glu T 2008 Thin Solid Films 516 967 [6] Pal B N, Sun J, Jung B J, Choi E, Andreou A G and Katz H E 2008 Adv. Mater. 20 1023 [7] Steudel S, Myny K, Arkhipov V, Deibel C, Vusser S D, Genoe J andHeremans P 2005 Nature Mater. 4 597 [8] Ma L P, Ouyang J Y and Yang Y 2004 Appl. Phys. Lett. 84 4786 [9] Craciun N I, Wildemand J and Blom P W M 2008 Phys. Rev. Lett. 100 056601 [10] Bullejos P L, Tejada J A J, Deen M J, Marinov O and Datars W R 2008 J. Appl. Phys. 103 064504 [11] Kumar P, Jain S C, Misra A, Kamalasanan M N and Kumar V2006 J. Appl. Phys. 100 114506 [12] Baude P F, Ender D A, Haase M A, Kelley T W, Muyres D V and Theiss S Det al 2003 Appl. Phys. Lett. 82 3964 [13] Shi Y, Liu J and Yang Y 2000 J. Appl. Phys. 87 4254 [14] Cusumano P, Buttitta F, Cristofalo A D and Cali C 2003 Syn. Met. 139 657 [15] Cao G H, Qin D S, Guan M, Cao J S, Zeng Y P and Li J M 2008 Chin. Phys. 17 1911 [16] Na J H, Kitamura M and Arakawa Y 2007 Appl. Phys. Lett. 91 193501 [17] Ma L P, Xu Q f and Y Yang 2004 Appl. Phys. Lett. 84 4908 [18] Hayashi N, Ishii H, Ouchi Y and Seki K 2002 J. Appl. Phys. 92 3784 [19] Maxwell A J, Bruhwiler P A, Aruanitis D and Hasselstrom 1998 J. Phys. Rev. B 57 7312 [20] Tung R T 1992 Phys. Rev. B 45 13509