ZONG Fu-Jian1, MA Hong-Lei1, LIANG Wei2, DU Wei1, ZHANG Xi-Jian1, XIAO Hong-Di1, MA Jin1, JI Feng1, XUE Cheng-Shan3, ZHUANG Hui-Zhao3
1School of Physics and Microelectronics, Shandong University, Jinan 250100
2Institute of Optoelectronic Materials and Technologies, Jinan University, Jinan 250003
3Institute of Semiconductor, Shandong Normal University, Jinan 250014
1School of Physics and Microelectronics, Shandong University, Jinan 250100
2Institute of Optoelectronic Materials and Technologies, Jinan University, Jinan 250003
3Institute of Semiconductor, Shandong Normal University, Jinan 250014
Abstract: Thermal gravimetric analysis (TGA) and differential thermal analysis (DTA) are employed to investigate the thermal decomposition behaviour of zinc nitride powder, which indicated that the thermal oxidation of zinc nitride powder in air follows the two-step reaction model. When the temperature is between 200 and 500°C, compact ZnO or ZnxOyNz layers in the surface of zinc nitride powder will begin to form, and prevent the interior of zinc nitride powder from the thermal oxidation. When the temperature is higher than 500°C, fast thermal oxidation occurs in the interior of zinc nitride powder. Over 750°C, all the zinc nitride will turn into zinc oxide. The x-ray diffraction (XRD) and Fourier transform infrared spectroscopy (FTIR) of the zinc nitride powder annealed at different temperature in air are consistent with the two-step reaction model.