FTIR Characterization of Fluorine Doped Silicon Dioxide Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition
WANG Peng-Fei1 , DING Shi-Jin1 , ZHANG Wei1 , ZHANG Jim-Yun1 , WANG Ji-Tao1 , WEI William Lee2
1 Department of Electronic Engineering, Fudan University, Shanghai 200433
2 Taiwan Semiconductor Manufacturing Co., Hsinchu, Taiwan, China
FTIR Characterization of Fluorine Doped Silicon Dioxide Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition
WANG Peng-Fei1 ;DING Shi-Jin1 ;ZHANG Wei1 ;ZHANG Jim-Yun1 ;WANG Ji-Tao1 ;WEI William Lee2
1 Department of Electronic Engineering, Fudan University, Shanghai 200433
2 Taiwan Semiconductor Manufacturing Co., Hsinchu, Taiwan, China
关键词 ：
81.15.Gh ,
85.40.-e ,
77.55.+f
Abstract ： Fluorine doped silicon dioxide (SiOF) thin films have been prepared by plasma enhanced chemical vapor deposition. The Fourier transform infrared spectrometry (FTIR) spectra of SiOF films are deliberated to reveal the structure change of SiO2 and the mechanism of dielectric constant reduction after doping fluorine. When F is doped in SiO2 films, the Si-O stretching absorption peak will have a blue-shift due to increase of the partial charge of the O atom. The FTIR spectra indicate that some Si-OH components in the thin film can be removed after doping fluorine. These changes reduce the ionic and orientational polarization, and result in the reduction in dielectric constant of the film. According to Gaussian fitting, it is found that the Si-F2 bonds will appear in the SiOF film with increase of the fluorine content. The Si-F2 structures are liable to react with water, and cause the same increase of absorbed moisture in the film.
Key words ：
81.15.Gh
85.40.-e
77.55.+f
出版日期: 2000-12-01
:
81.15.Gh
(Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.))
85.40.-e
(Microelectronics: LSI, VLSI, ULSI; integrated circuit fabrication technology)
77.55.+f
引用本文:
WANG Peng-Fei;DING Shi-Jin;ZHANG Wei;ZHANG Jim-Yun;WANG Ji-Tao;WEI William Lee. FTIR Characterization of Fluorine Doped Silicon Dioxide Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition[J]. 中国物理快报, 2000, 17(12): 912-914.
链接本文:
https://cpl.iphy.ac.cn/CN/
或
https://cpl.iphy.ac.cn/CN/Y2000/V17/I12/912
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