Properties of Diamond Film/Alumina Composites for Integrated Circuits with Ultra-High Speed and High Power
WANG Lin-Jun, XIA Yi-Ben, FANG Zhi-Jun, ZHANG Ming-Long, SHEN Hu-Jiang
School of Materials Science and Engineering, Shanghai University, Shanghai 201800
Properties of Diamond Film/Alumina Composites for Integrated Circuits with Ultra-High Speed and High Power
WANG Lin-Jun;XIA Yi-Ben;FANG Zhi-Jun;ZHANG Ming-Long;SHEN Hu-Jiang
School of Materials Science and Engineering, Shanghai University, Shanghai 201800
关键词 ：
81.05.Je ,
81.05.Uw ,
77.22.-d ,
68.60.Dv
Abstract ： We report the properties of the diamond film/alumina composites which were thought of as promising substrate materials for integrated circuits with ultra-high speed and high power. The measurement results of dielectric properties of diamond film/alumina composites show that the coating of CVD diamond films could effectively reduce the dielectric constant of the composite. Carbon ion implantation into alumina substrates prior to the diamond deposition can reduce the dielectric loss of the composite from 5 x 10-3 to 2 x 10-3 , and can give the composite better frequency stability. The thermal conductivity of composites could be obviously increased by coating CVD diamond film. The composite has a dielectric constant of 6.5 and a thermal conductivity of 3.98 W/(cmK) when the thickness of diamond film is up to 100 μm.
Key words ：
81.05.Je
81.05.Uw
77.22.-d
68.60.Dv
出版日期: 2004-06-01
:
81.05.Je
(Ceramics and refractories (including borides, carbides, hydrides, nitrides, oxides, and silicides))
81.05.Uw
77.22.-d
(Dielectric properties of solids and liquids)
68.60.Dv
(Thermal stability; thermal effects)
引用本文:
WANG Lin-Jun;XIA Yi-Ben;FANG Zhi-Jun;ZHANG Ming-Long;SHEN Hu-Jiang. Properties of Diamond Film/Alumina Composites for Integrated Circuits with Ultra-High Speed and High Power[J]. 中国物理快报, 2004, 21(6): 1161-1163.
链接本文:
https://cpl.iphy.ac.cn/CN/
或
https://cpl.iphy.ac.cn/CN/Y2004/V21/I6/1161
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2004, Vol. 21 
