CROSS-DISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY |
|
|
|
|
High-Frequency AlGaN/GaN High-Electron-Mobility Transistors with Regrown Ohmic Contacts by Metal-Organic Chemical Vapor Deposition |
GUO Hong-Yu1,2, LV Yuan-Jie1, GU Guo-Dong2, DUN Shao-Bo1, FANG Yu-Long1, ZHANG Zhi-Rong1, TAN Xin1, SONG Xu-Bo1, ZHOU Xing-Ye1, FENG Zhi-Hong1** |
1National Key Laboratory of ASIC, Hebei Semiconductor Research Institute, Shijiazhuang 050051 2Hebei Semiconductor Research Institute, Shijiazhuang 050051
|
|
Cite this article: |
GUO Hong-Yu, LV Yuan-Jie, GU Guo-Dong et al 2015 Chin. Phys. Lett. 32 118501 |
|
|
Abstract Nonalloyed ohmic contacts regrown by metal-organic chemical vapor deposition are performed on AlGaN/GaN high-electron-mobility transistors. Low ohmic contact resistance of 0.15 Ω?mm is obtained. It is found that the sidewall obliquity near the regrown interface induced by the plasma dry etching has great influence on the total contact resistance. The fabricated device with a 100-nm T-shaped gate demonstrates a maximum drain current density of 0.95 A/mm at Vgs=1 V and a maximum peak extrinsic transcondutance Gm of 216 mS/mm. Moreover, a current gain cut-off frequency fT of 115 GHz and a maximum oscillation frequency fmax of 127 GHz are achieved.
|
|
Received: 14 July 2015
Published: 01 December 2015
|
|
PACS: |
85.30.Tv
|
(Field effect devices)
|
|
73.40.Kp
|
(III-V semiconductor-to-semiconductor contacts, p-n junctions, and heterojunctions)
|
|
52.77.Bn
|
(Etching and cleaning)
|
|
|
|
|
[1] Lbbeston J P, Fini P T, Ness K D et al 2000 Appl. Phys. Lett. 77 250 [2] Gong R M, Wang J Y, Liu S H et al 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (Shanghai, China 1–4 November 2010) p 1353 [3] Jinwook W C, Tae-woo K and Tomas P 2010 IEEE Int. Electron. Devices Meeting (San Francisco, USA 6–8 December 2010) p 676 [4] Jinwook W C, William E K, Eduardo M C et al 2010 IEEE Electron Device Lett. 31 195 [5] Geum D M, Shin S H, Kim M S et al 2013 Electron. Lett. 49 1536 [6] Medjdoub F, Zegaoui M, Ducatteau D et al 2011 The 69th Annual Device Research Conference (California, USA 20–22 June 2011) p 219 [7] Recht F, McCarthy L, Rajan S, Chakraborty A et al 2006 IEEE Electron Device Lett. 27 205 [8] Buttari D, Chini A, Meneghesso G et al2002 IEEE Electron Device Lett. 23 76 [9] Yue Y Z, Hu Z Y, Guo J et al 2012 IEEE Electron Device Lett. 33 988 [10] Brown D F, Regan D C, Tang Y et al 2013 IEEE Electron Device Lett. 34 1118 [11] Dasgupta S, Nidhi, Brown D F et al 2010 Appl. Phys. Lett. 96 143504 [12] Shinohara K, Regan D, Corrion A et al 2011 IEEE Int. Electron. Devices Meeting (Washington DC, USA 5–7 December 2011) p 453 [13] Guo J, Li G W, Faria F, Cao Y et al 2012 IEEE Electron Device Lett. 33 525 [14] Huang T D, Zhu X L and Lau K M 2012 IEEE Electron Device Lett. 33 1123 [15] Huang J, Li M, Tang C W and Lau K M 2014 Chin. Phys. B 23 128102 |
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|