Chin. Phys. Lett.  2011, Vol. 28 Issue (6): 064601    DOI: 10.1088/0256-307X/28/6/064601
FUNDAMENTAL AREAS OF PHENOMENOLOGY(INCLUDING APPLICATIONS) |
Measuring Stress Distributions of Orthotropic Composite Material in Plane Stress State by the Lock-in Infrared Thermography Technique
LI Xu-Dong1**, WANG Wei-Bo2, LI Yong-Sheng2, WU Dong-Liu1
1China Aero-Polytechnology Establishment, Beijing 100028
2China Ship Scientific Research Center, Wuxi 214082
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LI Xu-Dong, WANG Wei-Bo, LI Yong-Sheng et al  2011 Chin. Phys. Lett. 28 064601
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Abstract Feasibility of measuring stress distributions of orthotropic composite materials and structures in plane stress state by the lock-in infrared thermography technique is analyzed and stress distributions of a lap joint structure made of a kind of glass reinforced plastic composite lamination plates under tensile loadings are obtained by the lock-in infrared thermography technique. Feasibility and credibility of using this technique to measure stress distributions of orthotropic composite materials and structures in plane stress state are proved by comparing the results with the data given by the digital speckle correlation method.
Keywords: 46.80.+j     
Received: 29 December 2010      Published: 29 May 2011
PACS:  46.80.+j (Measurement methods and techniques in continuum mechanics of solids)  
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https://cpl.iphy.ac.cn/10.1088/0256-307X/28/6/064601       OR      https://cpl.iphy.ac.cn/Y2011/V28/I6/064601
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LI Xu-Dong
WANG Wei-Bo
LI Yong-Sheng
WU Dong-Liu
[1] Li X D, Liu K X, Zhang G S, Wen S G and Tan F L 2008 Chin. Phys. Lett. 25 2965
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[3] Peyroux R, Chrysochoos A, Licht C and Lobel M 1998 Int. J. Engng Sci. 36 489
[4] Li X D, Liu X, Liu J Y and Wu D L 2011 Eng. Mech. 28 (in print) (in Chinese)
[5] Pitarresi G, Acquisto L D and Siddiolo A M 2008 J. Strain Anal. 43 493
[6] George S, Goravar S, Mishra D, Shyamsunder M T, Sharma P, Padmashree G K, Kumar P S, Bremond P and Mukherjee K 2010 Insight 52 470
[7] Dulieu-Barton J M and Stanley P 1998 J. Strain Anal. 33 93
[8] Emery T, Dulieu-Barton J M and Cunningham P R 2005 Key Eng. Mater. 293–294 583
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