Chin. Phys. Lett.  2009, Vol. 26 Issue (2): 027801    DOI: 10.1088/0256-307X/26/2/027801
CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES |
Characteristics Analysis of Vertical Double Gate Strained Channel Heterostructure Metal-Oxide-Semiconductor-Field-Effect-Transistor
YANG Yuan, LI Gui-Ping, GAO Yong, LIU Jing
Department of Electronic Engineering, Xi'an University of Technology, Xi'an 710048
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YANG Yuan, LI Gui-Ping, GAO Yong et al  2009 Chin. Phys. Lett. 26 027801
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Abstract Since device feature size shrinks continuously, there appears various short-channel effects on the fabrication and performance of devices and integrated circuits. We present a vertical double gate (VDG) strained channel heterostructure metal-oxide-semiconductor-field-effect-transistor (MOSFET). The electrical characteristics of the device with the effective gate length scaled down to 60nm are simulated. The results show that the drive current and transconductance are improved by 57.92% and 54.53% respectively, and grid swing is decreased by 36.83% over their unstrained counterparts. VDG MOSFETs exhibit a stronger capability to restrict short-channel-effects over traditional MOSFETs.
Keywords: 78.40.Fy      78.55.Ap      78.30.Am     
Received: 01 January 1900      Published: 20 January 2009
PACS:  78.40.Fy (Semiconductors)  
  78.55.Ap (Elemental semiconductors)  
  78.30.Am (Elemental semiconductors and insulators)  
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https://cpl.iphy.ac.cn/10.1088/0256-307X/26/2/027801       OR      https://cpl.iphy.ac.cn/Y2009/V26/I2/027801
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Articles by authors
YANG Yuan
LI Gui-Ping
GAO Yong
LIU Jing
[1] Tomohisa M, Naoharu S and Tsutomu T 2003 IEEE Trans.Electron. 50 988
[2] Laura P 2005 Semiconduct. Int. 5 47
[3] Yijian C and Albert C 2006 Microelectron. Engin. 83 1745
[4] Hoon C, Pwan K, Pranav K and Krishna C S 2007 IEEEInt. Electron Devices Meeting 80 917
[5] Mandal S K, Das S and Maiti C K 2005 Mater. Sci.Semiconduct. Proc. 8 353
[6] Olsen S H, O'Neil A G and Chattopadhyay S 2004 IEEETrans. Electron. Devices 51 1245
[7] Cheng Z Y, Cunie M T and Leitz C W 2001 IEEE Int.SOI Conf. (Durango, CO 1--4 October 2001) p 13
[8] Hoon C, Pawan K and Pranav K A 2008 IEEE Trans.Electron. Devices 55 632
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