Original Articles |
|
|
|
|
Effects of LSMO Buffer Layer on Crystalline Orientation and Ferroelectric Properties of Bi2.9Pr0.9Ti3O12 Thin Films Prepared by Radio-Frequency Magnetron Sputtering |
WU Yun-Yi1,2, ZHANG Duan-Ming1, YU Jun2, ZHENG Chao-Dan1,2, WANG Yun-Bo2 |
1School of Physics, Huazhong University of Science and Technology, Wuhan 4300742Department of Electronic Science and Technology, Huazhong University of Science and Technology, Wuhan 430074 |
|
Cite this article: |
WU Yun-Yi, ZHANG Duan-Ming, YU Jun et al 2008 Chin. Phys. Lett. 25 4131-4134 |
|
|
Abstract Ferroelectric Bi2.9Pr0.9Ti3O12/La0.67Sr0.33MnO3 (BPT/LSMO) films are fabricated on Pt(111)/TiO2/SiO2/Si substrates by rf-magnetron sputtering method. The influences of the LSMO deposition conditions and LSMO layer thickness on properties of BPT thin films are studied. The LSMO layer deposited at 300°C and 450°C favours preferred (117) orientation of BPT films, while deposited at 600°C for LSMO layer leads to strong (111)-preferred orientation of BPT film. With the LSMO buffer layer, the films exhibit improved ferroelectric properties and Pt/BPT/LSMO(20nm)/Pt capacitor shows the largest remnant polarization Pr of 18.4μC/cm2 at 14V. A similar change in dielectric constant with the increase of LSMO layer thickness is also observed and the highest dielectric constant of 342.7 is obtained for the Pt/BPT/LSMO(20nm)/Pt film. Compared with the Pt/BPT/Pt film, the Pt/BPT/LSMO/Pt films exhibit better fatigue endurance after 5×109 switching cycles. Moreover, the LSMO layer has apparent effect on leakage current density and the Pt/BPT/LSMO(20nm)/Pt film exhibits the lowest leakage current density.
|
Keywords:
77.80.-e
77.84.Dy
|
|
Received: 22 July 2008
Published: 25 October 2008
|
|
|
|
|
|
[1] Park B H, Kang B S, Bu S D, Noh T W, Lee L and Joe W 1999 Nature 401 682 [2] Kim H I, Song Y S, Sok J and Chung C W 2003 Thin Solid Films 429 114 [3] Lee H N, Hesse D, Zakharov N and Gosele U 2002 Science 296 2006 [4]Yan Z, Zhang W T, Wang Y, Zhang X, Li L, Zhao Q X, Du J and Liu B T 2007 Chin. Phys. Lett. 24 3559 [4] Zhang S T, Zhang X J, Cheng H W, Chen Y F, Liu Z G, Ming N B, Hu X B and Wang J Y 2003 Appl. Phys. Lett. 83 4378 [5] Li W, MA J, Song C H, Bao P, Lu X M, Zhu J S and Wang Y N 2004 Chin. Phys. Lett. 21 544 [7] Uchida H, Yoshikawa H, Okada I, matsuda H, Lijima T, Watanabe T, Kojima T and Funadkubo H 2002 Appl. Phys. Lett. 81 2229 [8] Wentai L et al 2003 J. Vac. Sci. Technol. A 21 787 [9] Noguchi Y and Miyayama M 2001 Appl. Phys. Lett. 78 1903 [10] Chen M, Wang Y, Liu Z L, Dong L, Yang X S and Yao K L 2004 Chin. Phys. Lett. 21 1811 [11] Liu Z L, Wang C C, Chen M, Yang Y and Yao K L 2004 Mater. Lett. 58 3648 [12] Zhai J W and Chen H 1993 Appl. Phys. Lett. 82 442 [13] Xue Z Q, Wu Q D and Li J 1991 Thin Film Physics (Beijing: Beijing Publishing House of Electronics Industry) p 105 [13] Lee J Y and Lee B S 2001 Mater. Sci. Eng. B 79 86. [15] Fujimori Y, Izumi N and Nakamura T 1997 Jpn. J. Appl. Phys. 36 5935 |
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|