Thin Film Encapsulation of Light-Emitting Diodes with Photopolymerized Polyacrylate and Silver Films

Chin. Phys. Lett.

2005, Vol. 22

Issue (10): 2684-2687 DOI:

Original Articles

Thin Film Encapsulation of Light-Emitting Diodes with Photopolymerized Polyacrylate and Silver Films

WANG Li-Duo;WU Zhao-Xin;LI Yang;QIU Yong

Key Laboratory of Organic Optoelectronics & Molecular Engineering of Ministry of Education, Department of Chemistry, Tsinghua University, Beijing 100084

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WANG Li-Duo, WU Zhao-Xin, LI Yang et al 2005 Chin. Phys. Lett. 22 2684-2687

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Abstract A thin film encapsulation of organic light-emitting diodes (OLEDs) is investigated with a multi-layer stack of polyacrylate-Ag-polyacrylate-Ag-polyacrylate-Ag-polyacrylate (PAPAPAP). It is shown that the fabrication of polyacrylate films by a wet process does not affect the electroluminescent (EL) characteristics of the devices and polyacrylate films together with the silver layers can perform to minimize oxygen and water diffusion into the organic light-emitting device. The structure of polyacrylate(20μm)-Ag(200nm) polyacrylate(20μm)-Ag(200nm)-polyacrylate(20μm)-Ag(200nm)-polyacrylate(20μm) is demonstrated to enhance dramatically the lifetime of OLEDs.

Keywords: 268478.60.Fi 81.15.Ef 81.65.Rv

Published: 01 October 2005

PACS:	268478.60.Fi
	81.15.Ef
	81.65.Rv	(Passivation)

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https://cpl.iphy.ac.cn/ OR https://cpl.iphy.ac.cn/Y2005/V22/I10/02684

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	WANG Li-Duo
	WU Zhao-Xin
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	QIU Yong

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