| CROSS-DISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY |
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Ultralow Specific on-Resistance Trench MOSFET with a U-Shaped Extended Gate |
| WANG Zhuo, LI Peng-Cheng, ZHANG Bo, FAN Yuan-Hang, XU Qing, LUO Xiao-Rong** |
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054
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| Cite this article: |
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WANG Zhuo, LI Peng-Cheng, ZHANG Bo et al 2015 Chin. Phys. Lett. 32 068501 |
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Abstract An ultralow specific on-resistance (Ron,sp) trench metal-oxide-semiconductor field effect transistor (MOSFET) with an improved off-state breakdown voltage (BV) is proposed. It features a U-shaped gate around the drift region and an oxide trench inserted in the drift region (UG MOSFET). In the on-state, the U-shaped gate induces a high density electron accumulation layer along its sidewall, which provides a low-resistance current path from the source to the drain, realizing an ultralow Ron,sp. The value of Ron,sp is almost independent of the drift doping concentration, and thus the UG MOSFET breaks through the contradiction relationship between Ron,sp and the off-state BV. Moreover, the oxide trench folds the drift region, enabling the UG MOSFET to support a high BV with a shortened cell pitch. The UG MOSFET achieves an Ron,sp of 2 mΩ?cm2 and an improved BV of 216 V, superior to the best existing state-of-the-art transistors at the same BV level.
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Received: 26 November 2014
Published: 30 June 2015
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| PACS: |
85.30.De
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(Semiconductor-device characterization, design, and modeling)
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85.30.Tv
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(Field effect devices)
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85.30.Mn
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(Junction breakdown and tunneling devices (including resonance tunneling devices))
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