CONDENSED MATTER: STRUCTURE, MECHANICAL AND THERMAL PROPERTIES |
|
|
|
|
Effect of Carbonized Conditions on Residual Strain and Crystallinity Quality of Heteroepitaxial Growth 3C-SiC Films |
CHEN Da, ZHANG Yu-Ming, ZHANG Yi-Men, WANG Yue-Hu, TANG Xiao-Yan |
School of Microelectronics, Xidian University, Xi'an 710071Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices, Xidian University, Xi'an 710071 |
|
Cite this article: |
CHEN Da, ZHANG Yu-Ming, ZHANG Yi-Men et al 2009 Chin. Phys. Lett. 26 086106 |
|
|
Abstract Heteroepitaxial growth of SiC on n-Si(111) substrates is performed by a low pressure chemical vapor deposition process. The effects of different carbonized temperature and carbonized time on the crystalline quality and the residual strain of 3C-SiC films are discussed. The results show that the residual strain is obviously reduced and the crystalline quality is greatly improved at the best carbonized temperature of 1000°C and the carbonized time of 5min. Under these optimized carbonization conditions, thick epitaxial films of about 15μm with good crystalline quality and low residual strain can be obtained.
|
Keywords:
61.82.Fk
81.15.Gh
|
|
Received: 04 May 2009
Published: 30 July 2009
|
|
PACS: |
61.82.Fk
|
(Semiconductors)
|
|
81.15.Gh
|
(Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.))
|
|
|
|
|
[1] Bushroa A R, Jacob C, Saiji H and Nishino S 2004 J. Cryst. Growth 271 200 [2] Nishiguchi T, Nakamura M, Nishio K, Isshiki T and Nishino S 2004 Appl. Phys. Lett. 84 3082 [3] Muller S G, Brady M F and Brixius W H 2003 Mater. Sci. Forum. 39 433 [4] Severino A, Arrigo G D, Bongiorno C, Via F L and Foti G 2007 J. Appl. Phys. 102 023518 [5] Zielinski M, Leycuras A, Ndiaye S and Chassagne T 2006 Appl. Phys. Lett. 89 131906 [6] Ferro G, Chassagne T, Leycuras A, Cauwet F and Monteil Y 2006 Chem.Vap. Deposition 12 483 [7] Hurt\`{os E and Viejo H R 2000 J. Appl. Phys. 87 1748 [8] Zgheib C, Mcneil L E, Kazan M, Masri P, Morales F M, Ambacher O andPezoldt J 2005 Appl. Phys. Lett. 87 041905 |
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|