| CONDENSED MATTER: STRUCTURE, MECHANICAL AND THERMAL PROPERTIES |
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Influence of pH on Nanofluids' Viscosity and Thermal Conductivity |
| WANG Xian-Ju1, LI Xin-Fang2 |
| 1Key Lab of Enhanced Heat Transfer and Energy Conservation of Ministry of Education, School of Chemical and Energy Engineering, South China University of Technology, Guangzhou 5106412Department of Packaging and Printing, Zhongshan Torch Vocation and Technology College, Zhongshan 528436 |
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| Cite this article: |
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WANG Xian-Ju, LI Xin-Fang 2009 Chin. Phys. Lett. 26 056601 |
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Abstract Aiming at the dispersion stability of nanoparticles regarded as the guide of heat transfer enhancement, we investigate the viscosity and the thermal conductivity of Cu and Al2O3 nanoparticles in water under different pH values. The results show that there exists an optimal pH value for the lowest viscosity and the highest thermal conductivity, and that at the optimal pH value the nanofluids containing a small amount of nanoparticles have noticeably higher thermal conductivity than that of the base fluid without nanoparticles. For the two nanofluids the enhancements of thermal conductivity are observed up to 13% (Al2O3-water) or 15% (Cu-water) at 0.4wt%, respectively. Therefore, adjusting the pH values is suggested to improve the stability and the thermal conductivity for practical applications of nanofluid.
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| Keywords:
66.20.Ej
82.70.Kj
47.27.Em
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Received: 21 November 2008
Published: 23 April 2009
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| PACS: |
66.20.Ej
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(Studies of viscosity and rheological properties of specific liquids)
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82.70.Kj
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(Emulsions and suspensions)
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47.27.em
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(Eddy-viscosity closures; Reynolds stress modeling)
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[1] Prasher R 2005 Phys. Rev. Lett. 94 025901
[2] Li X F, Zhu D S, Wang X J, Gao J W and Li H 2008 Thermochimica Acta 469 98
[3] Timofeeva E V, Gavrilov A N, McCloskey J M and Tolmachev YV 2007 Phy. Rev. E 76 061203
[4] Eastman J A, Choi U S, Li S, Thompson L J and Lee S 1996 Fall Meeting of the Materials Research Society (MRS,Pittsburgh, Boston, 2--6 December 1996) p 1
[5] Eastman J A, Phillpot S R, Choi S U S and Keblinski P 2004 Annu. Rev. Mater. Res. 34 219
[6] Assael M J, Metaxs I N, Kakosimos K and Constantinou D2006 Int. J. Thermophys. 27 999
[7] Jana S, Khojin A S and Zhong W H 2007 Thermochim.Acta 462 45
[8] Choi S U S, Zhang Z G and Yu W 2001 Appl. Phys.Lett. 79 2252
[9] Philip J, Shima P D and Raj B 2007 Appl. Phys. Lett. 91 203108
[10] Kumar D H, Patel H E, Kumar V R R, Sundararajan T,Pradeep T and Das S K 2004 Phys. Rev. Lett. 93 144301
[11]Lee D, Kim J W and Kim B G 2006 J. Phys. Chem. B 110 94323
[12]Keblinski P and Thomin J 2006 Phys. Rev. E 73010502
[13]Li X F, Zhu D S and Wang X J 2007 J. ColloidInterface Sci. 310 456
[14]Nguyen C T, Desgranges F, Roy G, Galanis N, Mare T,Boucher S and Angue M H 2007 Int. J. Heat and Fluid Flow 28 1492
[15]Li X F and Zhu D S 2006 Chem. Ind. Eng. Progress 25 875 (in Chinese)
[16]Hamilton R L and Crosser O K 1962 Ind. Eng. Chem.Fundam. 1 187 Hamilton R L and Crosser O K 1962 Ind. Eng. Chem.Fundam. 1 91 |
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