CONDENSED MATTER: STRUCTURE, MECHANICAL AND THERMAL PROPERTIES |
|
|
|
|
Forces Acting on Submillimeter Spheres at the Air–Water Interface |
WANG Le-Feng, LIU Lu, XU Hui-Chao, RONG Wei-Bin**, SUN Li-Ning |
State Key Laboratory of Robotics and System, Harbin Institute of Technology, Harbin 150080
|
|
Cite this article: |
WANG Le-Feng, LIU Lu, XU Hui-Chao et al 2015 Chin. Phys. Lett. 32 116801 |
|
|
Abstract The forces acting on submillimeter spheres at the air–water interface are investigated theoretically and experimentally. To calculate the capillary force acting on the sphere, an iterative method is used to determine the immersing position of the liquid interface on the sphere for a given distance. Then the total forces acting on the sphere are considered. The scaling effects of the net force acting on the sphere at the air–water interface are demonstrated. For the experiments, the force-position relationship of microspheres is measured with a precise electronic balance. The results show that the evaporation of the liquid in the container affects the measuring results greatly under ambient conditions. After considering the evaporation compensation, there is a great agreement between the theoretical and experimental results. Obvious hysteresis phenomena of the force-distance curve during the emersion processes are also observed and explained.
|
|
Received: 07 June 2015
Published: 01 December 2015
|
|
PACS: |
68.03.Cd
|
(Surface tension and related phenomena)
|
|
68.08.-p
|
(Liquid-solid interfaces)
|
|
47.55.dr
|
(Interactions with surfaces)
|
|
|
|
|
[1] Mastrangeli M, Abbasi S, Varel C, Van Hoof C, Celis J P and B?hringer K F 2009 J. Micromech. Microeng. 19 083001 [2] Morris C J and Parviz B A 2008 J. Micromech. Microeng. 18 015002 [3] Ershov D, Sprakel J, Appel J, Cohen Stuart M A and van der Gucht J 2013 Proc. Natl. Acad. Sci. USA 110 9220 [4] Zhao Y P, Wang L S and Yu T X 2003 J. Adhesion. Sci. Technol. 17 519 [5] Hariri A, Zu J W and Mrad R B 2006 J. Micromech. Microeng. 16 1195 [6] Huang Y, Vasan A S S, Doraiswami R, Osterman M and Pecht M 2012 IEEE Trans. Device Mater. Reliab. 12 482 [7] Gorb S N 2008 Philos. Trans. R. Soc. A 366 1557 [8] Liu S, Liu Z W and Shi W X 2014 Chin. Phys. Lett. 31 106801 [9] Song Y S and Sitti M 2007 IEEE Trans. Rob. 23 578 [10] Yuan J and Cho S K 2012 J. Mech. Sci. Technol. 26 3761 [11] Malotky D L and Chaudhury 2001 Langmuir 17 7823 [12] Zitzler L, Herminghaus S and Mugele F 2002 Phys. Rev. B 66 155436 [13] Zheng W and Zhao Y P 2004 Chin. Phys. Lett. 21 616 [14] Paajanen M, Katainen J, Pakarinen O H, Foster A S and Lahtinen J 2006 J. Colloid Interf. Sci. 304 518 [15] Kwon S, Stambaugh C, Kim B, An S and Jhe W 2014 Nanoscale 6 5474 [16] Zhang L, Ren L and Hartland S 1996 J. Colloid Interface Sci. 180 493 [17] Zhang L, Ren L and Hartland S 1997 J. Colloid Interface Sci. 192 306 [18] Chatterjee N, Lapin S and Flury M 2012 Environ. Sci. Technol. 46 4411 [19] Shang J, Flury M and Deng Y 2009 Water Resour. Res. 45 W06420 [20] Chatterjee N and Flury M 2013 Langmuir 29 7903 |
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|