Undercooling and Unidirectional Solidification of CuNi Alloy Melts

Chin. Phys. Lett.

2008, Vol. 25

Issue (10): 3808-3810 DOI:

Original Articles

Undercooling and Unidirectional Solidification of CuNi Alloy Melts

WANG Qiang, MA Ming-Zhen, JING Qin, LI Gong, QI Li, ZHANG Xin-Yu, WANG Wen-Kui, LIU Ri-Ping

State Key Laboratory of Metastable Materials Science and Technology, Yanshan University, Qinhuangdao 066004

Cite this article:

WANG Qiang, MA Ming-Zhen, JING Qin et al 2008 Chin. Phys. Lett. 25 3808-3810

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Abstract

Cylinder-shaped Cu₈₀Ni₂₀alloy melt is undercooled and solidified by the combination of the electromagnetic levitation technique and the flux treatment method. Nearly constant temperature gradient of 8-10K/cm is realized for the cylindrical melts with different undercooling levels at the bottom ends. The experimental results reveal that with the increase of the undercooling of the melts from 35 to 220K, the microstructures undergo transition from coarse dendrites to granular grains, unidirectional dendrites, and finally to equiaxed grains.

Keywords: 81.30.Fb 81.10.Dn 81.10.Aj

Received: 22 April 2008 Published: 26 September 2008

PACS:	81.30.Fb	(Solidification)
	81.10.Dn	(Growth from solutions)
	81.10.Aj	(Theory and models of crystal growth; physics and chemistry of crystal growth, crystal morphology, and orientation)

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https://cpl.iphy.ac.cn/ OR https://cpl.iphy.ac.cn/Y2008/V25/I10/03808

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	WANG Qiang
	MA Ming-Zhen
	JING Qin
	LI Gong
	QI Li
	ZHANG Xin-Yu
	WANG Wen-Kui
	LIU Ri-Ping

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