| Original Articles |
|
|
|
|
Polyethylene Oxide Films Polymerized by Radio Frequency Plasma-Enhanced Chemical Vapour Phase Deposition and Its Adsorption Behaviour of Platelet-Rich Plasma |
| HU Wen-Juan1, XIE Fen-Yan1, CHEN Qiang1, WENG Jing2 |
| 1Laboratory of Plasma Physics and Materials, Beijing Institute of Graphic Communication, Beijing 1026002School of Basic Medical Sciences, Capital Medical University, Beijing 100069 |
|
| Cite this article: |
|
HU Wen-Juan, XIE Fen-Yan, CHEN Qiang et al 2008 Chin. Phys. Lett. 25 3805-3807 |
|
|
|
|
Abstract We present polyethylene oxide (PEO) functional films polymerized by rf plasma-enhanced vapour chemical deposition (rf-PECVD) on p-Si (100) surface with precursor ethylene glycol dimethyl ether (EGDME) and diluted Ar in pulsed plasma mode. The influences of discharge parameters on the film properties and compounds are investigated. The film structure is analysed by Fourier transform infrared (FTIR) spectroscopy. The water contact angle measurement and atomic force microscope (AFM) are employed to examine the surface polarity and to detect surface morphology, respectively. It is concluded that the smaller duty cycle in pulsed plasma mode contributes to the rich C--O--C (EO) group on the surfaces. As an application, the adsorption behaviour of platelet-rich plasma on plasma polymerization films performed in-vitro is explored. The shapes of attached cells are studied in detail by an optic invert microscope, which clarifies that high-density C--O--C groups on surfaces are responsible for non-fouling adsorption behaviour of the PEO films.
|
| Keywords:
81.15.Gh
|
|
|
Received: 02 April 2008
Published: 26 September 2008
|
|
| PACS: |
81.15.Gh
|
(Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.))
|
|
|
|
|
|
[1] Abraham K M and Jiang Z 1997 J. Electron. Soc. 144 136
[2] Meyer E and Braun H 2005 Phys. Condens. Matter 17 623
[3] Chen G R, Shi P F, Bai Y P and Fan T B 2003 Funct.Mater. 34 176
[4] Zhao H Q 1993 Plasma Chemistry and Technology(Hefei: China Technology College Publishing Company) p 45 (inChinese)
[5] Chen Q, Zhang Y F and Ge Y J et al 2005 PackagingEngin. 26 12 (in Chinese)
[6] Zhou M L, Chen Q and Ge Y J 2006 Vacuum Sci.Technol. 26 412 (in Chinese)
[7] Zhang J 2003 Thin Solid Films 435 108
[8] Xue W B, Lai Y C and Deng Z W et al 1997 Mater. Sci.Technol 5 89 (in Chinese)
[9] Jiang B L and Zhang X F 2005 J. Chin. Soc. Corros.Prot. 25 97 (in Chinese)
[10] Chen Q 2006 J. Phys. Chem. B 110 9231 |
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
