Chin. Phys. Lett.  2006, Vol. 23 Issue (1): 42-44    DOI:
Original Articles |
Self-Assembly of Micro-Parts onto Si Substrates at Liquid--Liquid Interface
LIU Mei;ZHANG Jian-Gang;LV Yao;XIA Shan-Hong
State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080
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LIU Mei, ZHANG Jian-Gang, LV Yao et al  2006 Chin. Phys. Lett. 23 42-44
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Abstract We report a new approach for the self-assembly of cuboid micro-parts onto Si substrates to construct three-dimensional microstructures. To perform assembly, the Si substrates are prepared with a deep cavity array as binding sites. An aggregate composed of hundreds of uniformly aligned micro-parts is formed at the C10F18--H2O interface. The micro-parts are arranged by passing the substrate through the aggregate of micro-parts, thus the micro-parts are left on the substrate, and then the substrate is vibrated ultrasonically in the solution, making it possible for the micro-parts to fall into the cavities on the substrate. Finally the substrate is pulled out of the solution after assembly. This technique could give a high yield of up to 70%, providing a new method for micro-assembly.
Keywords: 05.70.Np      47.20.Dr      82.45.Mp      83.10.Bb     
Published: 01 January 2006
PACS:  05.70.Np (Interface and surface thermodynamics)  
  47.20.Dr (Surface-tension-driven instability)  
  82.45.Mp (Thin layers, films, monolayers, membranes)  
  83.10.Bb (Kinematics of deformation and flow)  
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https://cpl.iphy.ac.cn/       OR      https://cpl.iphy.ac.cn/Y2006/V23/I1/042
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LIU Mei
ZHANG Jian-Gang
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XIA Shan-Hong
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