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Effect of Temperature on the Void Growth in Pure Aluminium at High Strain-Rate Loading |
| QI Mei-Lan 1;2;HE Hong-Liang1;YAN Shi-Lin2 |
| 1Laboratory for Shock Wave and Detonation Physics Research, Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 6219002School of Science, Wuhan University of Technology, Wuhan 430070 |
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| Cite this article: |
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QI Mei-Lan, HE Hong-Liang, YAN Shi-Lin 2007 Chin. Phys. Lett. 24 2271-2273 |
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Abstract With the environment temperature varying from 273K to 773K, the dynamic
process of void growth in pure aluminium at high strain-rate loading is
calculated based on the dynamic growth equation of a void with internal
pressure. The result shows that the effect of temperature on the growth
of void should be emphasized. Because the initial pressure of void with gas will increase and the viscosity of materials will decrease with the rising of temperature, the growth of void is accelerated. Furthermore, material inertia restrains the growth of void evidently when the diameter exceeds 10μm. The effect of surface tension is very weak in the whole process of void growth.
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47.11.+j
83.10.j
62.50.+p
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Received: 25 December 2006
Published: 25 July 2007
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