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Self-Assembly of Micro-Parts onto Si Substrates at Liquid--Liquid Interface |
| LIU Mei;ZHANG Jian-Gang;LV Yao;XIA Shan-Hong |
| State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080 |
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| Cite this article: |
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LIU Mei, ZHANG Jian-Gang, LV Yao et al 2006 Chin. Phys. Lett. 23 42-44 |
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Abstract We report a new approach for the self-assembly of cuboid micro-parts onto Si substrates to construct three-dimensional microstructures. To perform assembly, the Si substrates are prepared with a deep cavity array as binding sites. An aggregate composed of hundreds of uniformly aligned micro-parts is formed at the C10F18--H2O interface. The micro-parts are arranged by passing the substrate through the aggregate of micro-parts, thus the micro-parts are left on the substrate, and then the substrate is vibrated ultrasonically in the solution, making it possible for the micro-parts to fall into the cavities on the substrate. Finally the substrate is pulled out of the solution after assembly. This technique could give a high yield of up to 70%, providing a new method for micro-assembly.
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| Keywords:
05.70.Np
47.20.Dr
82.45.Mp
83.10.Bb
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Published: 01 January 2006
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| PACS: |
05.70.Np
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(Interface and surface thermodynamics)
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47.20.Dr
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(Surface-tension-driven instability)
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82.45.Mp
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(Thin layers, films, monolayers, membranes)
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83.10.Bb
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(Kinematics of deformation and flow)
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