| CONDENSED MATTER: STRUCTURE, MECHANICAL AND THERMAL PROPERTIES |
|
|
|
|
Polymer-Sandwich Ultra-Thin Silicon(100) Platform for Flexible Electronics |
| Yong-Hua Zhang1**, S. Karthikeyan2, Jian Zhang1 |
1Department of Electronic Science and Engineering, East China Normal University, Shanghai 200241
2Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis 55455, USA
|
|
| Cite this article: |
|
Yong-Hua Zhang, S. Karthikeyan, Jian Zhang 2016 Chin. Phys. Lett. 33 066201 |
|
|
|
|
Abstract As a potential flexible substrate for flexible electronics, a polymer-sandwiched ultra-thin silicon platform is studied. SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by an ANSYS simulation. Using the plasma enhanced chemical vapor deposited SiO$_{2}$/Si$_{3}$N$_{4}$ composite film as an etching mask, a $4''$ silicon-(100) wafer is thinned to 26 μm without rupture in a 30 wt.% KOH solution. The thinned wafer is coated on both sides with 20 μm of SU-8 photoresist and is cut into strips. Then the strips are bent by a caliper to measure its bending radius. A sector model of bending deformation is adopted to estimate the radius of curvature. The determined minimal bending radius of the polymer-sandwiched ultra-thin silicon layer is no more than 3.3 mm. The fabrication process of this sandwich structure can be used as a post-fabrication process for high performance flexible electronics.
|
|
|
Received: 11 November 2015
Published: 30 June 2016
|
|
| PACS: |
62.20.D-
|
(Elasticity)
|
| |
61.82.Pv
|
(Polymers, organic compounds)
|
| |
61.90.+d
|
(Other topics in structure of solids and liquids; crystallography)
|
|
|
|
|
|
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
