CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES |
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Direct Experimental Evidence of Hole Trapping in Negative Bias Temperature Instability |
JI Xiao-Li1, LIAO Yi-Ming1, YAN Feng1**, SHI Yi1, ZHANG Guan2, GUO Qiang2
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1Institute of Electronics Science and Engineering, Nanjing University, Nanjing 210093
2QRE/Reliability Engineering, SMIC, 18 Wenchang Road, BDA, Beijing 100176
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Cite this article: |
JI Xiao-Li, LIAO Yi-Ming, YAN Feng et al 2011 Chin. Phys. Lett. 28 107302 |
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Abstract Negative bias temperature instability (NBTI) in ultrathin-plasma-nitrided-oxide (PNO) based p-type metal-oxide-semiconductor field effect transistors (pMOSFETs) is investigated at temperatures ranging from 220 K to 470 K. It is found that the threshold voltage VT degradation below 290 K is dominated by the hole trapping process. Further studies unambiguously show that this process is unnecessarily related to nitrogen but the incorporation of nitrogen in the gate dielectric increases the probability of hole trapping in the NBTI process as it introduces extra trap states located in the upper half of the Si band gap. The possible hole trapping mechanism in NBTI stressed PNO pMOSFETs is suggested by taking account of oxygen and nitrogen related trap centers.
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Keywords:
73.40.Qv
85.30.Tv
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Received: 28 June 2011
Published: 28 September 2011
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PACS: |
73.40.Qv
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(Metal-insulator-semiconductor structures (including semiconductor-to-insulator))
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85.30.Tv
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(Field effect devices)
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[1] Campbell J P and Lenahan P M 2002 Appl. Phys. Lett. 80 1945
[2] Ogawa S and Shiono N 1995 Phys. Rev. B 51 4218
[3] Huard V and Denais M 2006 Microelectronics Reliability 46 1
[4] Grasser T and Kaczer B 2009 IEEE Trans. Electron Device 56 1056
[5] Mitani Y, Satake H and Toriumi A 2008 IEEE Trans. Device Mater. Reliab. 8 6
[6] Mahapatra S, Maheta V D, Islam A E and Alam M A 2009 IEEE Trans. Electron. Devices 56 236
[7] Mahapatra S, Ahmed K, Varghese D, Islam A E, Gupta G, Madhav L, Saha D and Alam M A 2007 IEEE 45th Annual International Reliability Physics Symposium p 1
[8] Ang D S, Wang S and Ling C H 2005 IEEE Electron. Device Lett. 26 906
[9] Ielmini D 2009 IEEE Trans. Electron. Device 56 1943
[10] Aivars J L and Timothy R O 1994 IEEE Trans. Nucl. Sci. 41 1835
[11] Ryan J T, Lenahan P M, Grasser T and Enichlmair H 2010 Appl. Phys. Lett. 96 223509
[12] Campbell J P, Lenahan P M, Cochrane C J, Krishnan A T and Krishnan S 2007 IEEE Trans. Device Mater. Rel. 7 540
[13] Kamigaki Y, Minami S and Kato H 1990 J. Appl. Phys. 68 2211
[14] Belyi V I and Rastorguyev A 2000 Chem. Sustain. Develop. 8 13
[15] Thomas A T, Nelhiebel M, Decker S and Grasser T 2010 Appl. Phys. Lett. 96 133511
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