CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES |
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Controllable Ultra Low- k by Via-Typed Air Gap with the Better Design Margin for Logic Devices below 45nm Node |
CHOI Youn-Ok1, KIM Sang-Yong2 |
1Department of Electrical Engineering, Chosun University, #375, Seosuk-dong, Dong-gu, Gwangju 501-759, Republic of Korea 2Department of Semiconductor System, Korea Polytechnic College IV, Cheongju 361-857, Republic of Korea |
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Cite this article: |
CHOI Youn-Ok, KIM Sang-Yong 2010 Chin. Phys. Lett. 27 097701 |
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Abstract By changing the air gap to a via-typed air gap, the height of the air gap is reduced up to about 50% compared to the height of the trench-typed air gap. The controllable (1≤k <2.9) ultra low-k is also easily fabricated by adjusting the space of the via-typed air gap. The via-typed air gap makes the design margin better due to its lower height in the dense and narrow lines.
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Keywords:
77.55.-g
77.55.Bh
77.55.df
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Received: 04 May 2010
Published: 25 August 2010
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