CONDENSED MATTER: STRUCTURE, MECHANICAL AND THERMAL PROPERTIES |
|
|
|
|
Characterization of Thick GaN Films Directly Grown on Wet-Etching Patterned Sapphire by HVPE |
HU Qiang1, WEI Tong-Bo2, DUAN Rui-Fei2, YANG Jian-Kun2, HUO Zi-Qiang2, LU Tie-Cheng1, ZENG Yi-Ping2 |
1Department of Physics and Key Laboratory for Radiation Physics and Technology of Ministry of Education, Sichuan University, Chengdu 6100642Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083 |
|
Cite this article: |
HU Qiang, WEI Tong-Bo, DUAN Rui-Fei et al 2009 Chin. Phys. Lett. 26 096801 |
|
|
Abstract Thick GaN films of high quality are directly grown on wet-etching patterned sapphire in a vertical hydride vapour phase epitaxy reactor. The optical and structural properties of GaN films are studied using scanning electronic microscopy and cathodoluminescence. Test results show that initial growth of hydride vapour phase epitaxy GaN occurs not only on the mesas but also on the two asymmetric sidewalls of the V-shaped grooves without selectivity. After the two-step coalescence near the interface, the GaN films near the surface keep on growing along the direction perpendicular to the long sidewall. Based on Raman results, GaN of the coalescence region in the grooves has the maximum residual stress and poor crystalline quality over the whole GaN film, and the coalescence process can release the stress. Therefore, stress-free thick GaN films are prepared with smooth and crack-free surfaces by this particular growth mode on wet-etching patterned sapphire substrates.
|
Keywords:
68.55.-a
73.61.Ey
78.60.Hk
81.15.Kk
|
|
Received: 18 March 2009
Published: 28 August 2009
|
|
PACS: |
68.55.-a
|
(Thin film structure and morphology)
|
|
73.61.Ey
|
(III-V semiconductors)
|
|
78.60.Hk
|
(Cathodoluminescence, ionoluminescence)
|
|
81.15.Kk
|
(Vapor phase epitaxy; growth from vapor phase)
|
|
|
|
|
[1] Nakamura S, Senoh M, Iwasa N and Nagahama S 1995 Appl. Phys. Lett. 67 1868 [2] Sakai S, Wang T, Morishima Y and Naoi Y 2000 J.Cryst. Growth 221 334 [3] Chen C, Jiang W H, Ren C J, Li Z H, Jiao G, Dong X andChen T S 2007 Chin. Phys. Lett. 24 2707 [4] Oh E, Lee S K, Park S S, Lee K Y, Song I J and Han J Y2001 Appl. Phys. Lett. 78 273 [5] Wang J, Guo L W, Jia H Q, Xing Z G, Wang Y, Yan J F, Yu NS, Chen H and Zhou J M 2005 J. Cryst. Growth 290 398 [6] Cuong T V, Cheong H S, Kim H G, Kim H Y, Honga C H and SuhE K 2007 Appl. Phys. Lett. 90 131107 [7] Wang J, Guo L W, Jia H Q, Wang Y, Xing Z G, Li W, Chen Hand Zhou J M 2006 J. Electrochem. Soc. 153 C182 [8] Lee X J, Shin E H and Lim K Y 2004 Appl. Phys. Lett. 85 1502 [9] Wei T B, Duan R F, Wang J X, Li J M, Huo Z Q, Ma P, Liu Zand Zeng Y P 2007 J. Phys. D 40 2881 [10] Shinya B, Hideto M, Kazumasa H, Yoshihiko T and TakayoshiM 2005 Jpn. J. Appl. Phys. 44 24 [11] Wagner V, Parillaud O, Buhlmann H J, and Ilegems M 2002 J. Appl. Phys. 92 1307 [12] Wei T B, Ma P, Duan R F, Wang J X, Li J M and Zeng Y P2007 Chin. Phys. Lett. 24 822 [13] Perlin P, Lauberthie C C, Itie J P et al 1992 Phys.Rev. B 45 83 |
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|