| CONDENSED MATTER: STRUCTURE, MECHANICAL AND THERMAL PROPERTIES |
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Preparation and Thermal Characterization of Diamond-Like Carbon Films |
| BAI Su-Yuan1,2, TANG Zhen-An1, HUANG Zheng-Xing1, Yu Jun1, WANG Jing3, LIU Gui-Chang3 |
| 1Department of Electronic Engineering, Dalian University of Technology, Dalian 1160242School of Physics and Electronic Technology, Liaoning Normal University, Dalian 1160293School of Chemical Engineering, Dalian University of Technology, Dalian 116012 |
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| Cite this article: |
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BAI Su-Yuan, TANG Zhen-An, HUANG Zheng-Xing et al 2009 Chin. Phys. Lett. 26 076601 |
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Abstract Diamond-like carbon (DLC) films are prepared on silicon substrates by microwave electron cyclotron resonance plasma enhanced chemical vapor deposition. Raman spectroscopy indicates that the films have an amorphous structure and typical characteristics. The topographies of the films are presented by AFM images. Effective thermal conductivities of the films are measured using a nanosecond pulsed photothermal reflectance method. The results show that thermal conductivity is dominated by the microstructure of the films.
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| Keywords:
66.70.-f
81.15.Gh
81.70.Fy
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Received: 18 December 2008
Published: 02 July 2009
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| PACS: |
66.70.-f
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(Nonelectronic thermal conduction and heat-pulse propagation in solids;thermal waves)
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81.15.Gh
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(Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.))
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81.70.Fy
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(Nondestructive testing: optical methods)
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[1] Yoon S F, Tan K H et al 2001 Thin Solid films 396 62
[2] Veerasamy V S, Luten H A et al 2003 Thin Solid Films 442 107
[3] Takeuchi S, Tanji A et al 2004 Thin Solid Films 447 208
[4] Pandey M, Bhatacharyya D et al 2005 J. Alloys. Compd. 386 296
[5] Shirakura A, Nakaya M et al 2006 Thin Solid Films 494 84
[6] Luo J K, Flevitt A J et al 2004 Appl. Phys. Lett. 85 5748
[7] Luo J K, Fu Y Q et al 2007 J. Micromech. Microeng. 17 S147
[8] Chiu S M, Lee S C et al 2008 J. Alloys. Compd. 449 379
[9] Reinke S and Kulisch W 1997 Surf. Coat. Technol. 97 23
[10] Kading O W, Skurk H and Goodson K E 1994 Appl. Phys.Lett. 65 1629
[11] Burzo M G, Komarov P L and Raad P E 2002 Microelect.J. 33 697
[12] Chen G and Hui P 1999 Thin Solid films 339 58
[13] Stehfest H 1970 Commun. ACM 13 47
[14] Huang Z X, Tang Z A et al 2006 J. Mater. Sci.Technol. 22 339
[15] Bai S Y, Tang Z A et al 2008 Chin. Phys. Lett. 25 593
[16] Christopher J M, Humphrey J M et al 1994 J. Appl.Phys. 76 2636
[17] Shamsa M, Liu W L et al 2006 Appl. Phys. Lett. 89 16921
[18] D. G. Cahill, S. K. Watson and R. O. Pohl 1992 Phys.Rev. B 46 6131
[19] E. T. Swartz and R. O. Pohl 1989 Rev. Mod. Phys. 61 605 |
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