Chin. Phys. Lett.  2005, Vol. 22 Issue (12): 3126-3129    DOI:
Original Articles |
Microstructure and Wear Behaviour of WC Film Prepared by Pulsed High Energy Density Plasma
LIU Yuan-Fu1;HAN Jian-Min1;ZHANG Gu-Ling2;WANG Jiu-Li2;YANG Si-Ze2
1Institute of Materials Science and Engineering, Beijing Jiaotong University, Beijing 100044 2Institute of Physics, Chinese Academy of Sciences, Beijing 100080
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LIU Yuan-Fu, HAN Jian-Min, ZHANG Gu-Ling et al  2005 Chin. Phys. Lett. 22 3126-3129
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Abstract A super hard and wear resistant WC film is in-situ prepared on a 0.45% C steel substrate by pulsed high energy density plasma technique at ambient temperature. The microstructure and composition of the film are analysed by x-ray diffraction, x-ray photoelectron spectroscopy, Auger electron spectroscopy and scanning electron microscopy. The hardness profile and tribological behaviour of the film are determined with nano-indenter and wear tester, respectively. The results show that the microstructure of the film was dense and uniform and mainly composed of WC and a small amount of W2C. A wide mixing interface exists between the film and the 0.45%C steel substrate. The thickness of the film is about 2μm. The hardness and Yang’s modulus of the film are very high. The film has excellent wear resistance and low friction coefficient under dry sliding wear test conditions.
Keywords: 52.77.Dq      68.55.Jk      81.40.Pq     
Published: 01 December 2005
PACS:  52.77.Dq (Plasma-based ion implantation and deposition)  
  68.55.Jk  
  81.40.Pq (Friction, lubrication, and wear)  
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https://cpl.iphy.ac.cn/       OR      https://cpl.iphy.ac.cn/Y2005/V22/I12/03126
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LIU Yuan-Fu
HAN Jian-Min
ZHANG Gu-Ling
WANG Jiu-Li
YANG Si-Ze
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