| Original Articles |
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Microstructure Transition of Liquid Metal Al During Heating and Cooling Processes
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| LIU Rang-Su1;LIU Hai-Rong2;ZHENG Cai-Xing1;LU Xiao-Yong3;PENG Ping1;LI Ji-Yong2 |
| 1Department of Physics, Hunan University, Changsha 410082
2Department of Chemistry, Hunan University, Changsha 410082
3Department of Electrical Engineering, Hunan University, Changsha 410082
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| Cite this article: |
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LIU Rang-Su, LIU Hai-Rong, ZHENG Cai-Xing et al 2001 Chin. Phys. Lett. 18 1383-1385 |
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Abstract A simulation study of the transition properties of microstructures of liquid metal Al during heating and cooling processes has been performed by the molecular dynamics method. It is demonstrated that in the temperature range of 1800--350K, the 1551, 1541, 1431, 1311, 1321, and 1422 bond types represented by the Honeycutt-Andersen index play an important role. Especially, the 1551 bond type plays a leading role and is the decisive factor for the change of the second peak of the pair distribution function from a smooth sine peak into two split secondary peaks via a platform during all the processes of microstructure transitions. From the variation curve of the
1551 bond type, it can be clearly seen that there are five rapidly changing ranges corresponding qualitatively to the critical transition points of microstructures of the system detected experimentally.
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| Keywords:
61.20.Ja
61.25.Mv
61.43.Bn
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Published: 01 October 2001
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| PACS: |
61.20.Ja
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(Computer simulation of liquid structure)
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61.25.Mv
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(Liquid metals and alloys)
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61.43.Bn
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(Structural modeling: serial-addition models, computer simulation)
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