2011, Vol. 28(10): 107303-107303    DOI: 10.1088/0256-307X/28/10/107303
A High Breakdown Voltage AlGaN/GaN MOSHEMT Using Thermal Oxidized Al-Ti as the Gate Insulator
ZHOU Bin1, WANG Jin-Yan1**, MENG Di1, LIN Shu-Xun2, FANG Min1, DONG Zhi-Hua2, YU Min1, HAO Yi-Long1, Cheng P. WEN1
1Institute of Microelectronics, Peking University, Beijing 100871
2 Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences, Suzhou 215123
收稿日期 2011-07-03  修回日期 1900-01-01
Supporting info
[1] Wu Y F, Moore M, Saxler A, Wisleder T and Parikh P 2006 64th Device Research Conference (Pennsylvania State College, PA, USA 26–28 June 2006) p 151
[2] Dora Y, Chakraborty A, McCarthy L, Keller S, DenBaars S P and Mishra U K 2006 IEEE Electron. Device Lett. 27 713
[3] Breckenridge R G and Hosler W R 1953 Phys. Rev. 91 793
[4] Yagi S, Shimizu M, Inada M, Yamamoto Y, Piao G, Okumura H, Yano Y, Akutsu N and Ohashi H 2006 Solid-State Electron. 50 1057
[5] Liu Q Z and Lau S S 1998 Solid-State Electron. 42 677
[6] Ye P D, Yang B, Ng K K, Bude J, Wilk G D, Halder S and Hwang J C M 2005 Appl. Phys. Lett. 86 063501
[7] Ootomo S, Hashizume T and Hasegawa H 2002 Phys. Status Solidi C 0 90
[8] Gutierrez G and Johansson B 2002 Phys. Rev. B 65 104202
[9] Mo S-D and Ching W Y 1995 Phys. Rev. B 51 13023
[10] Kordos P, Gregusova D, Stoklas R, Cico K and Novak J 2007 Appl. Phys. Lett. 90 123513
[11] Ohno Y, Nakao T, Kishimoto S, Maezawa K and Mizutani T 2004 Appl. Phys. Lett. 84 2184
[12] Kim H, Lee J, Liu D and Lu W 2005 Appl. Phys. Lett. 86 143505