2009, Vol. 26(2): 28103-028103 DOI: 10.1088/0256-307X/26/2/028103 | ||
Cation Effect on Copper Chemical Mechanical Polishing | ||
WANG Liang-Yong1,2, LIU Bo1, SONG Zhi-Tang1, FENG Song-Lin1 | ||
1Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 2000502Graduate School of the Chinese Academy of Sciences, Beijing 100049 | ||
收稿日期 2008-06-12 修回日期 1900-01-01 | ||
Supporting info | ||
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