2007, Vol. 24(4): 1110-1113 DOI: | ||
A Flip-Chip AlGaInP LED with GaN/Sapphire Transparent Substrate Fabricated by Direct Wafer Bonding | ||
LIANG Ting, GUO Xia, GUAN Bao-Lu, GUO Jing, GU Xiao-Ling, LIN Qiao-Ming, SHEN Guang-Di | ||
Beijing Optoelectronic Technology Laboratory, College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022 | ||
收稿日期 2006-12-13 修回日期 1900-01-01 | ||
Supporting info | ||
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