2010, Vol. 27(8): 88501-088501 DOI: 10.1088/0256-307X/27/8/088501 | ||
Three-Dimensional Finite Element Simulations for the Thermal Characteristics of PCRAMs with Different Buffer Layer Materials | ||
GONG Yue-Feng1,2, SONG Zhi-Tang1, LING Yun1, LIU Yan1, LI Yi-Jin1, FENG Song-Lin1 |
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1State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences, Shanghai 200050 2Graduate School of the Chinese Academic of Sciences, Beijing 100049 | ||
收稿日期 2010-05-05 修回日期 1900-01-01 | ||
Supporting info | ||
[1] Kang D, Kim I H, Jeong J H et al 2006 J. Appl. Phys. 100 054506 |
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