2010, Vol. 27(8): 88501-088501    DOI: 10.1088/0256-307X/27/8/088501
Three-Dimensional Finite Element Simulations for the Thermal Characteristics of PCRAMs with Different Buffer Layer Materials

GONG Yue-Feng1,2, SONG Zhi-Tang1, LING Yun1, LIU Yan1, LI Yi-Jin1, FENG Song-Lin1

1State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences, Shanghai 200050 2Graduate School of the Chinese Academic of Sciences, Beijing 100049
收稿日期 2010-05-05  修回日期 1900-01-01
Supporting info

[1] Kang D, Kim I H, Jeong J H et al 2006 J. Appl. Phys. 100 054506
[2] Kim Y T, Hwang Y N, Lee K H et al 2005 Jpn. J. Appl. Phys. 44 2701
[3] Morales-Sanchez E, Prokhorov E F, Gonzalez-Hernandez J et al 2005 Thin Solid Films 471 243
[4] Zhang T, Song Z T, Gong Y F et al 2008 Appl. Phys. Lett. 92 113503
[5] Xu C, Song Z T et al 2008 Appl. Phys. Lett. 92 062103
[6] Rao F, Song Z T, Gong Y F et al 2008 Appl. Phys. Lett. 92 223507
[7] Gong Y F et al 2009 Jpn. J. Appl. Phys. 48 064505
[8] Gong Y F et al 2008 Chin. Phys. Lett. 25 3455