A Novel Fabrication Method for Flexible SOI Substrate Based on Trench Refilling with Polydimethylsiloxane
ZHANG Cang-Hai, YANG Yi, WANG Yu-Feng, ZHOU Chang-Jian, SHU Yi, TIAN He, REN Tian-Ling**
Institute of Microelectronics, Tsinghua University, Beijing 100084 Tsinghua National Laboratory for Information Science and Technology, Tsinghua University, Beijing 100084
Abstract：Flexible arrays based on the flexible connection of double layers are demonstrated. Flexible sensor arrays are highly desired for many applications. Conventional flexible electronics are implemented by directly fabricating them on organic flexible substrates such as polyimide or polyethylene terephthalate, or forming on rigid substrates and then transferring them onto elastomeric substrates. For the first time, a novel process method based on trench refilling with polydimethylsiloxane to make flexible arrays is proposed. In this method, the sensors are directly fabricated on islands of the final bulk silicon. The performance of the sensor will not to be effected by bending and stretching operations. A one-dimensional flexible array shows good flexibility. Since the flexibility process is the last fabrication step, this method is compatible with many micro-electro-mechanical system fabrication technologies and has good yield.
(Other topics in structure of solids and liquids; crystallography)
引用本文:
. [J]. 中国物理快报, 2013, 30(8): 86201-086201.
ZHANG Cang-Hai, YANG Yi, WANG Yu-Feng, ZHOU Chang-Jian, SHU Yi, TIAN He, REN Tian-Ling. A Novel Fabrication Method for Flexible SOI Substrate Based on Trench Refilling with Polydimethylsiloxane. Chin. Phys. Lett., 2013, 30(8): 86201-086201.
2013, Vol. 30 
