Effect of F- and CH-Doped on Dielectric Properties of SiCOH Films Deposited by Decamethylcyclopentasiloxane Electron Cyclotron Resonance Plasma

We investigate the effect of CH-doped and F-doped on dielectric properties of SiCOH films deposited by decamethylcyclopentasiloxane (DMCPS) electron cyclotron resonance plasma. The dielectric constant k is closely related to the configurations of films. For the films deposited only using DMCPS, the minimum k is as low as 2.88. By adding CH₄ in the precursor, the k value can be reduced to 2.45 due to the film density decreasing by incorporating large size CH_x groups. By adding CHF₃ in the precursor, the k value can also be reduced to 2.48 due to the incorporation of the weak-polarization F atom. Thus the dielectric constant for SiCOH films depends on not only the film density but also the polarization of atoms. By increasing the film density or by reducing the polarization of atoms under the condition of a lower film density, the low dielectric constant SiCOH films can be obtained.