Dielectric Properties of Multilayered Ba_0.5Sr_0.5TiO₃ Thin Films Deposited on ITO-Coated Corning 1737 Glass by rf Magnetron Sputtering

A new stacking method via variation of substrate temperature in rf magnetron sputter is used to fabricate polycrystalline/polycrystalline Ba_0.5Sr_0.5TiO₃ thin films with higher dielectric constant, higher breakdown strength and lower leakage current densities than those prepared by a conventional deposition method. The improved figure of merit G (ε₀ε_rE_b) of the Ba_0.5Sr_0.5TiO₃ thin films implies that they are a feasible insulation layer for thin film electroluminescent devices.