Nanostructure and Properties of Corrosion Resistance in C+TiMulti-Ion-Implanted Steel
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Abstract
The corrosion and pitting corrosion resistance of C+Ti dual and C+Ti+C ternary implanted H13 steel were studied by using a multi-sweep cyclic voltammetry and a scanning electron microscope. The effects of phase formation on corrosion and pitting corrosion resistance were explored. The x-ray diffraction analysis shows that the nanometer-sized precipitate phases consist of compounds of Fe2Ti, TiC, Fe2C and Fe3C in dual implanted layer and even in ternary implanted layer. The passivation layer consists of these nanometer phases. It has been found that the corrosion and pitting corrosion resistance of dual and ternary implanted H13 steel are improved extremely. The corrosion resistance of ternary implanted layer is better than that of dual implantations and is enhanced with the increasing ion dose. When the ion dose of Ti is 6 x 1017/cm2 in the ternary implantation sample, the anodic peak current density is 95 times less than that of the H13 steel. The pitting corrosion potential of dual and ternary implantation samples is in the range from 55 mV to 160 mV which is much higher than that of the H13 steel. The phases against the corrosion and pitting corrosion are nanometer silkiness phases.
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ZHANG Tong-He, WU Yu-Guang, LIU An-Dong, ZHANG Xu, WANG Xiao-Yan. Nanostructure and Properties of Corrosion Resistance in C+TiMulti-Ion-Implanted Steel[J]. Chin. Phys. Lett., 2003, 20(9): 1548-1551.
ZHANG Tong-He, WU Yu-Guang, LIU An-Dong, ZHANG Xu, WANG Xiao-Yan. Nanostructure and Properties of Corrosion Resistance in C+TiMulti-Ion-Implanted Steel[J]. Chin. Phys. Lett., 2003, 20(9): 1548-1551.
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ZHANG Tong-He, WU Yu-Guang, LIU An-Dong, ZHANG Xu, WANG Xiao-Yan. Nanostructure and Properties of Corrosion Resistance in C+TiMulti-Ion-Implanted Steel[J]. Chin. Phys. Lett., 2003, 20(9): 1548-1551.
ZHANG Tong-He, WU Yu-Guang, LIU An-Dong, ZHANG Xu, WANG Xiao-Yan. Nanostructure and Properties of Corrosion Resistance in C+TiMulti-Ion-Implanted Steel[J]. Chin. Phys. Lett., 2003, 20(9): 1548-1551.
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