A Novel Fabrication Method for Flexible SOI Substrate Based on Trench Refilling with Polydimethylsiloxane

Flexible arrays based on the flexible connection of double layers are demonstrated. Flexible sensor arrays are highly desired for many applications. Conventional flexible electronics are implemented by directly fabricating them on organic flexible substrates such as polyimide or polyethylene terephthalate, or forming on rigid substrates and then transferring them onto elastomeric substrates. For the first time, a novel process method based on trench refilling with polydimethylsiloxane to make flexible arrays is proposed. In this method, the sensors are directly fabricated on islands of the final bulk silicon. The performance of the sensor will not to be effected by bending and stretching operations. A one-dimensional flexible array shows good flexibility. Since the flexibility process is the last fabrication step, this method is compatible with many micro-electro-mechanical system fabrication technologies and has good yield.