The Structural and Electrical Properties of Al/Pb(Zr0.52Ti0.48)O3/Al2O3/Si with an Al2O3 Layer Prepared by using the Molecular Atomic Deposition Method
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Abstract
The structural and electrical properties of a metal-ferroelectric-insulator-semiconductor (MFIS) structure with an Al2O3 layer prepared by using the molecular atomic deposition method and Pb(Zr0.52Ti0.48)O3 (PZT) deposited by the radio frequency magnetron sputtering method are investigated. PZT exhibits a very smooth surface and (110) orientation of the perovskite phase. The MFIS structure shows well-behaved clockwise capacitance-voltage hysteresis loops due to the ferroelectric polarization under a sweep voltage up to ±40 V. Memory windows of 1.9 V and 18.14 V in conjunction with leakage current density of 2.42×10?7 A/cm2 and 8.28×10?7 A/cm2 are obtained under sweep voltages of ±5 V and ±20 V, respectively.
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YANG Yi, ZHOU Chang-Jian, PENG Ping-Gang, XIE Dan, REN Tian-Ling, PAN Xiao, LIU Jing-Song. The Structural and Electrical Properties of Al/Pb(Zr0.52Ti0.48)O3/Al2O3/Si with an Al2O3 Layer Prepared by using the Molecular Atomic Deposition Method[J]. Chin. Phys. Lett., 2012, 29(12): 128501. DOI: 10.1088/0256-307X/29/12/128501
YANG Yi, ZHOU Chang-Jian, PENG Ping-Gang, XIE Dan, REN Tian-Ling, PAN Xiao, LIU Jing-Song. The Structural and Electrical Properties of Al/Pb(Zr0.52Ti0.48)O3/Al2O3/Si with an Al2O3 Layer Prepared by using the Molecular Atomic Deposition Method[J]. Chin. Phys. Lett., 2012, 29(12): 128501. DOI: 10.1088/0256-307X/29/12/128501
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YANG Yi, ZHOU Chang-Jian, PENG Ping-Gang, XIE Dan, REN Tian-Ling, PAN Xiao, LIU Jing-Song. The Structural and Electrical Properties of Al/Pb(Zr0.52Ti0.48)O3/Al2O3/Si with an Al2O3 Layer Prepared by using the Molecular Atomic Deposition Method[J]. Chin. Phys. Lett., 2012, 29(12): 128501. DOI: 10.1088/0256-307X/29/12/128501
YANG Yi, ZHOU Chang-Jian, PENG Ping-Gang, XIE Dan, REN Tian-Ling, PAN Xiao, LIU Jing-Song. The Structural and Electrical Properties of Al/Pb(Zr0.52Ti0.48)O3/Al2O3/Si with an Al2O3 Layer Prepared by using the Molecular Atomic Deposition Method[J]. Chin. Phys. Lett., 2012, 29(12): 128501. DOI: 10.1088/0256-307X/29/12/128501
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