Electrical Characterization of Deep Trap Properties in High-k Thin-Film HfO2 Dielectric
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Abstract
Deep-trap properties of high-dielectric-constant (k) HfO2 thin films are investigated by deep-level transient spectroscopy and capacitance-voltage methods. The hole traps of the HfO2 dielectric deposited on a p-type Si substrate by sputtering are investigated in a metal-oxide-semiconductor structure over a temperature range of 300-500 K. The potential depth, cross section and concentration of hole traps are estimated to be about 2.5 eV, 1.8× 10-16 cm2 and 1.0× 1016 cm-3, respectively.
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YANG Lu. Electrical Characterization of Deep Trap Properties in High-k Thin-Film HfO2 Dielectric[J]. Chin. Phys. Lett., 2010, 27(7): 077102. DOI: 10.1088/0256-307X/27/7/077102
YANG Lu. Electrical Characterization of Deep Trap Properties in High-k Thin-Film HfO2 Dielectric[J]. Chin. Phys. Lett., 2010, 27(7): 077102. DOI: 10.1088/0256-307X/27/7/077102
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YANG Lu. Electrical Characterization of Deep Trap Properties in High-k Thin-Film HfO2 Dielectric[J]. Chin. Phys. Lett., 2010, 27(7): 077102. DOI: 10.1088/0256-307X/27/7/077102
YANG Lu. Electrical Characterization of Deep Trap Properties in High-k Thin-Film HfO2 Dielectric[J]. Chin. Phys. Lett., 2010, 27(7): 077102. DOI: 10.1088/0256-307X/27/7/077102
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