A Novel Ni/Ag/Pt Ohmic Contact to P-Type GaN for Flip-Chip Light-Emitting Diodes

We present a high-quality Ni/Ag/Pt Ohmic contact to p-type GaN. After the sample is annealed at 500°C in O₂ ambient for 3min, a specific contact resistance as low as 2.6×10^-5Ω.cm² and an optical reflectivity of 82% at 460nm are obtained. The Auger electron spectroscopy analysis shows that the Pt layer can improve the surface morphology and thermal reliability of the annealed Ag-based electrode, Ag plays a key role in achieving good ohmic contact due to the outdiffusion of Ga into Ag forming Ga vacancies which increase the hole concentration, while the surface contamination of p-type GaN is reduced by Ni.