Experimental Results with Siliconization in Reversed Field Pinch Device
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ZHANG Peng,
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LI Qiang,
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LUO Cui-wen,
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LI Jie-ping,
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FANG Shui-quan,
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YI Ping,
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XUE Jun,
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LI Ke-hua,
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LUO Jun-lin,
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CAO Zeng,
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HONG Wen-yu,
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ZHANG Nian-man,
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WANG Quan-ming,
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LU Jie,
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HUANG Ming,
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ZHONG Yun-ze,
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ZHANG Qing-chun,
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LUO Cui-xian
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Abstract
Reversed field pinch ( RFP ) and ultralow safety factor plasma experimental performances with pulsed discharge cleaning and siliconization on SWIP-RFP device are presented. The wall siliconization was performed by using the device discharges. The experimental results with siliconization in RFP devices showed that the impurity concentrations were decreased in the plasma and better plasma parameters were obtained in the device.
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