The Impact of Shallow-Trench-Isolation Mechanical Stress on the Hysteresis Effect of Partially Depleted Silicon-on-Insulator n-Type Metal-Oxide-Semiconductor Field Effects
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Abstract
The impact of shallow trench isolation (STI) mechanical stress on the hysteresis effect in the output characteristics is measured in partially depleted (PD) silicon-on-insulator (SOI) metal-oxide-semiconductor field effect transistors (MOSFETs). We develop ID hysteresis, which is defined as the difference between ID versus VD forward sweep and reverse sweep. The fabricated devices show positive and negative peaks in ID hysteresis. The experimental results show that ID hysteresis declined as the STI mechanical stress increases. We also elaborate on the impact of STI mechanical stress on the ID hysteresis of PD SOI n-type MOSFETs.
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LUO Jie-Xin, CHEN Jing, CHAI Zhan, L Kai, HE Wei-Wei, YANG Yan, WANG Xi. The Impact of Shallow-Trench-Isolation Mechanical Stress on the Hysteresis Effect of Partially Depleted Silicon-on-Insulator n-Type Metal-Oxide-Semiconductor Field Effects[J]. Chin. Phys. Lett., 2014, 31(12): 126601. DOI: 10.1088/0256-307X/31/12/126601
LUO Jie-Xin, CHEN Jing, CHAI Zhan, L Kai, HE Wei-Wei, YANG Yan, WANG Xi. The Impact of Shallow-Trench-Isolation Mechanical Stress on the Hysteresis Effect of Partially Depleted Silicon-on-Insulator n-Type Metal-Oxide-Semiconductor Field Effects[J]. Chin. Phys. Lett., 2014, 31(12): 126601. DOI: 10.1088/0256-307X/31/12/126601
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LUO Jie-Xin, CHEN Jing, CHAI Zhan, L Kai, HE Wei-Wei, YANG Yan, WANG Xi. The Impact of Shallow-Trench-Isolation Mechanical Stress on the Hysteresis Effect of Partially Depleted Silicon-on-Insulator n-Type Metal-Oxide-Semiconductor Field Effects[J]. Chin. Phys. Lett., 2014, 31(12): 126601. DOI: 10.1088/0256-307X/31/12/126601
LUO Jie-Xin, CHEN Jing, CHAI Zhan, L Kai, HE Wei-Wei, YANG Yan, WANG Xi. The Impact of Shallow-Trench-Isolation Mechanical Stress on the Hysteresis Effect of Partially Depleted Silicon-on-Insulator n-Type Metal-Oxide-Semiconductor Field Effects[J]. Chin. Phys. Lett., 2014, 31(12): 126601. DOI: 10.1088/0256-307X/31/12/126601
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