CONDENSED MATTER: STRUCTURE, MECHANICAL AND THERMAL PROPERTIES |
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Bubble Behavior and Heat Transfer of Nucleate Pool Boiling on Micro-Pin-Finned Surface in Microgravity |
WEI Jin-Jia1**, XUE Yan-Fang1, ZHAO Jian-Fu2, LI Jing2
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1State Key Laboratory of Multiphase Flow in Power Engineering, Xi'an Jiaotong University, Xi'an 710049
2Key Laboratory of Microgravity (National Microgravity Laboratory)/CAS, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190
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Cite this article: |
WEI Jin-Jia, XUE Yan-Fang, ZHAO Jian-Fu et al 2011 Chin. Phys. Lett. 28 016401 |
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Abstract Nucleate pool boiling on micro-pin-finned surface structure is proposed for efficiently cooling electronic components with high heat flux in microgravity, and was verified by experiments performed utilizing the drop tower Beijing. Micro-pin-fins with the dimensions of 50×60μm2 (thickness × height) and the space of 50 μm were fabricated on the chip surface by the dry etching technique. FC-72 was used as the working fluid. Nucleate pool boiling of FC-72 on a smooth surface was also tested for comparison. Unlike much obvious deterioration of heat transfer of nucleate pool boiling on the smooth surface in microgravity, constant heater surface temperature of nucleate pool boiling for the micro-pin-finned surface was observed, even though a large coalesced bubble completely covered the surface under microgravity condition. The performance of high efficient heat transfer on micro-pin-finned surface is independent of the gravity, which stems from the sufficient supply of fresh liquid to the heater surface due to the capillary forces.
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Keywords:
64.70.Fh
44.35.+c
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Received: 08 July 2010
Published: 23 December 2010
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PACS: |
64.70.fh
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(Boiling and bubble dynamics)
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44.35.+c
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(Heat flow in multiphase systems)
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[1] Zhao J F, Li J, Yan N and Wang S F 2010 Chin. Phys. Lett. 27 076401
[2] Oktay S 1982 Proceeding of 7th International Heat Transfer Conference (Munich 6–10 September 1982) p 113
[3] Hwang U P and Moran K F 1981 Heat Transfer Electron. Equip. ASME HTD 20 53
[4] Kubo H, Takamatsu H and Honda H 1999 J. Enhanced Heat Transfer 6 151
[5] O'Connor J P, You S M and Price D C 1995 IEEE Trans. Comp. Packageing Manufact. Tchnol. 18 656
[6] Chang J Y and You S M 1996 ASME J. Heat Transfer 118 937
[7] Chang J Y and You S M 1997 Int. J. Heat Mass Transfer 40 4449
[8] Wei J J, Guo L J and Honda H 2005 Heat Mass Transfer 41 744
[9] Wei J J and Honda H 2003 Int. J. Heat Mass Transfer 46 4059
[10] Ma A X, Wei J J, Yuan M Z and Fang J B 2009 Int. J. Heat Mass Transfer 52 2925
[11] Wei J J, Zhao J F, Yuan M Z and Xue Y F 2009 Microgravity Sci. Technol. 21 S159–S173
[12] Zhao J F, Li J and Yan N 2009 Microgravity Sci. Technol. 21 S175
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