Chin. Phys. Lett.  2005, Vol. 22 Issue (12): 3133-3136    DOI:
Original Articles |
Self-Assembly of Gold Nanoparticles on Nanometre-Patterned Surface
ZHANG Yong-Jun1,2;YANG Jing-Hai1;LI Wei2;ZHANG Yu2;XU Ling2;XU Jun2;HUANG Xin-Fan2;CHEN Kun-Ji2
1Institute of Solid State Physics, Jilin Normal University, Siping 136000 2National Laboratory of Solid State Microstructures and Department of Physics, Nanjing University, Nanjing 210093
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ZHANG Yong-Jun, YANG Jing-Hai, LI Wei et al  2005 Chin. Phys. Lett. 22 3133-3136
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Abstract The self-assembly processes of gold nanoparticles on nanometre-step-patterned Si surface and polished Si surface are investigated by the convective self-assembly method. The convective self-assembly method is used to deposit the colloids dispersed in benzene onto the substrates. The SEM results show that the configurations of the gold arrays depend on the surface morphology of the substrates. On the nanometre-step-patterned Si surface, the nanoparticles self assemble into parallel lines, and the distance between the neighbouring lines is around 35nm. On the polished Si surface the nanoparticles form compact domains. In each domain the particles are close-packed in a two-dimensional hexagonal superlattice and are separated by uniform distances. The analysis shows that on the nanometre-step-patterned Si surface, the steps play critical roles in the self-assembly process of gold nanoparticles. The capillary force from the steps drives the particles to lines along the steps. Therefore, the particles tend to self-assemble into one-dimensional
line structures when the solvent evaporates. For the polished Si substrate there is a little difference that the particles form two-dimensional hexagonal superlattices without the directional confinement.
Keywords: 61.46.+w      81.16.Dn     
Published: 01 December 2005
PACS:  61.46.+w  
  81.16.Dn (Self-assembly)  
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https://cpl.iphy.ac.cn/       OR      https://cpl.iphy.ac.cn/Y2005/V22/I12/03133
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ZHANG Yong-Jun
YANG Jing-Hai
LI Wei
ZHANG Yu
XU Ling
XU Jun
HUANG Xin-Fan
CHEN Kun-Ji
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