| CONDENSED MATTER: STRUCTURE, MECHANICAL AND THERMAL PROPERTIES |
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Theoretical Models on Interfacial Thermal Conductance of Nanoscale Solid Interfaces in Chips: A Mini Review |
| Zhicheng Zong1, Xiandong Chen2,3*, Bin Yan2,3, Yelei Xie2,3, Jian Pang2,3, Guangyao Li2,3, Jiqiang Hu1, Zhipeng Wu1, Bo Li1, Haisheng Fang1, and Nuo Yang1* |
1School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
2Department of Packaging and Testing Institution, Sanechips Technology Co., Ltd., Shenzhen 518055, China
3State Key Laboratory of Mobile Network and Mobile Multimedia Technology, ZTE Corporation, Shenzhen 518055, China
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Zhicheng Zong, Xiandong Chen, Bin Yan et al 2024 Chin. Phys. Lett. 41 106301 |
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Abstract With the rapid increase in power density of electronic devices, thermal management has become urgent for the electronics industry. Controlling temperature in the back-end-of-line is crucial for maintaining the reliability of integrated circuits, where many atomic-scale interfaces exist. The theoretical models of interface thermal conductance not only accurately predict the values but also help to analyze the underlying mechanism. This review picks up and introduces some representative theoretical models considering interfacial roughness, elastic and inelastic processes, and electron–phonon couplings, etc. Moreover, the limitations and problems of these models are also discussed.
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Received: 01 April 2024
Review
Published: 26 September 2024
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| PACS: |
63.20.K-
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(Phonon interactions)
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68.35.-p
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(Solid surfaces and solid-solid interfaces: structure and energetics)
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44.10.+i
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(Heat conduction)
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46.25.Cc
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(Theoretical studies)
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