2009, Vol. 26(1): 17303-017303 DOI: 10.1088/0256-307X/26/1/017303 | ||
Optimizing Design of Breakdown Voltage to Eliminate Back Gate Bias Effect in Silicon-on-Insulator Diode Using Low Doping Buried Layer | ||
HO Chi-Hon1, LIAO Chien-Nan1, CHIEN Feng-Tso2, TSAI Yao-Tsung1 | ||
1Department of Electrical Engineering, National Central University, 300 Jhongda Rd., Jhongli 320, Taoyuan, Taiwan2Department of Electronic Engineering, Feng Chia University, 100 Wenhwa Rd., Seatwen, Taichung 407, Taiwan | ||
收稿日期 2008-09-18 修回日期 1900-01-01 | ||
Supporting info | ||
[1] Merchant S, Arnold E, Baumagart H, Mukherjee S, Pein H and [2] Chung S K, Han S Y, Shin J C, Choi Y I and Kim S B 1996 [3] Sun Z, Sun W and Shi L 2005 Solid-State Electron. [4] Huang Y S and Baliga B J 1991 Proceedings of the 3rd [5] Merchant S, Arnold E, Baumagart H, Egloff R, Letavic T, [6] Ho C H, Liao C N, Chien F T and Tsai Y T 2008 Jpn. J. [7] Nakagawa A, Yamaguchi Y, Yasuhara N, Hirayama K and Funaki [8] Tong D W, Benjamin J L and Dell W R V 1986 IEEE [9] ISE TCAD Manuals, release 8.5 [10] Sze S M 1981 Physics of Semiconductor Devices |
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