中国物理快报  2013, Vol. 30 Issue (8): 87201-087201    DOI: 10.1088/0256-307X/30/8/087201
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Effects of the Bridging Bond on Electronic Transport in a D-B-A Device
LI Ming-Jun1, LONG Meng-Qiu1,2**, XU Hui1**
1School of Physics and Electronics, Central South University, Changsha 410083
2Institute of Super Microstructure and Ultrafast Process, Central South University, Changsha 410083