Chin. Phys. Lett.  2013, Vol. 30 Issue (3): 36501-036501    DOI: 10.1088/0256-307X/30/3/036501
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The Physical-Mechanism Based High-Temperature Thermal Contact Conductance Model with Experimental Verification
LIU Dong-Huan**, SHANG Xin-Chun
School of Mathematics and Physics, University of Science & Technology Beijing, Beijing 100083