Formation of Co-implanted Silicon Ultra-Shallow Junctions for Low Thermal Budget Applications
Rehana Mustafa1, S. Ahmed2,3*, E. U. Khan3,4
1Department of Physics, International Islamic University, Islamabad, Pakistan 2Advanced Electronics Laboratory, Faculty of Engineering & Technology, International Islamic University Islamabad, Pakistan 3Center for Emerging Sciences, Engineering and Technology, Islamabad, Pakistan 4Department of Physics, Gomal University, D. I. Khan, Pakistan
Abstract：We present a systematic study to create ultra-shallow junctions in n-type silicon substrates and investigate both pre- and post-annealing processes to create a processing strategy for potential applications in nano-devices. Starting wafers were co-implanted with indium and C atoms at energies of 70 keV and 10 keV, respectively. A carefully chosen implantation schedule provides an abrupt ultra-shallow junction between 17 and 43 nm with suppressed sheet resistance and appropriate retained sheet carrier concentration at low thermal budget. A defect doping matrix, primarily the behavior and movement of co-implant generated interstitials at different annealing temperatures, may be engineered to form sufficiently activated ultra-shallow devices.
2013, Vol. 30 
