Simulation of Light Intensification Induced by Defects of Polished Fused Silica
WANG Feng-Rui1, LIU Hong-Jie1, HUANG Jin1, ZHOU Xin-Da1, JIANG Xiao-Dong1**, WU Wei-Dong1, ZHENG Wan-Guo1, JU Xin2
1Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900 2Department of Physics, University of Science and Technology Beijing, Beijing 100083
Simulation of Light Intensification Induced by Defects of Polished Fused Silica
WANG Feng-Rui1, LIU Hong-Jie1, HUANG Jin1, ZHOU Xin-Da1, JIANG Xiao-Dong1**, WU Wei-Dong1, ZHENG Wan-Guo1, JU Xin2
1Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900 2Department of Physics, University of Science and Technology Beijing, Beijing 100083
摘要Light intensity distribution in the vicinity of inclusions and etched cracks in polished fused silica at wavelength scale are simulated by using the finite-difference time-domain algorithm. Light intensity enhancement factor as functions of diameter and refractive index of inclusions are investigated, more than 10 times that of incident beam is obtained in the simulation. We model the etched crack in close proximity to a real structure, which is characterized by AFM. We find that the peak light intensity of the crack is a function of its cross sectional breadth depth ratio, providing good hints for the effective processing of fused silica samples to improve the damage threshold.
Abstract:Light intensity distribution in the vicinity of inclusions and etched cracks in polished fused silica at wavelength scale are simulated by using the finite-difference time-domain algorithm. Light intensity enhancement factor as functions of diameter and refractive index of inclusions are investigated, more than 10 times that of incident beam is obtained in the simulation. We model the etched crack in close proximity to a real structure, which is characterized by AFM. We find that the peak light intensity of the crack is a function of its cross sectional breadth depth ratio, providing good hints for the effective processing of fused silica samples to improve the damage threshold.
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