An Effective Three-Dimensional Micromagnetic Method and Its Application to Magnetic Tunnel Junctions
LIU Yao-Wen, CHEN Yu-Guang, YANG Ya-Ping, CHEN Hong, Martins J. L.
1 Department of Physics, Tongji University, Shanghai 200092
2 INESC Microsystems and Nanotechnologies, Rua Alves Redol 9, 1000 Lisbon, Portugal
An Effective Three-Dimensional Micromagnetic Method and Its Application to Magnetic Tunnel Junctions
LIU Yao-Wen;CHEN Yu-Guang;YANG Ya-Ping;CHEN Hong;Martins J. L.
1 Department of Physics, Tongji University, Shanghai 200092
2 INESC Microsystems and Nanotechnologies, Rua Alves Redol 9, 1000 Lisbon, Portugal
关键词 :
85.70.Kh ,
75.40.Mg ,
75.60.Ej
Abstract : An effective three-dimensional micromagnetic method for predicting equilibrium configuration of magnetization states is presented with conjugate-gradient technique to minimize the total energy, which has a much faster convergence rate than that of the quasi-Newton method. As an application, magnetic tunnel junctions with pinholes in the ultrathin barrier are simulated. The calculated coupling field Hf increases with the pinhole density increase, corresponding to the decrease of barrier thickness. The free layer domain configuration of tunnel junction during the switching process is also demonstrated.
Key words :
85.70.Kh
75.40.Mg
75.60.Ej
出版日期: 2005-05-01
:
85.70.Kh
(Magnetic thin film devices: magnetic heads (magnetoresistive, inductive, etc.); domain-motion devices, etc.)
75.40.Mg
(Numerical simulation studies)
75.60.Ej
(Magnetization curves, hysteresis, Barkhausen and related effects)
引用本文:
LIU Yao-Wen;CHEN Yu-Guang;YANG Ya-Ping;CHEN Hong;Martins J. L.. An Effective Three-Dimensional Micromagnetic Method and Its Application to Magnetic Tunnel Junctions[J]. 中国物理快报, 2005, 22(5): 1270-1273.
LIU Yao-Wen, CHEN Yu-Guang, YANG Ya-Ping, CHEN Hong, Martins J. L.. An Effective Three-Dimensional Micromagnetic Method and Its Application to Magnetic Tunnel Junctions. Chin. Phys. Lett., 2005, 22(5): 1270-1273.
链接本文:
https://cpl.iphy.ac.cn/CN/
或
https://cpl.iphy.ac.cn/CN/Y2005/V22/I5/1270
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