A 0.18-μm 3.3V 16k Bits 1R1T Phase Change Random Access Memory (PCRAM) Chip
DING Sheng, SONG Zhi-Tang, LIU Bo, ZHU Min, CHEN Xiao-Gang, CHEN Yi-Feng, SHEN Ju, FU Cong, FENG Song-Lin
State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences, Shanghai 200050
A 0.18-μm 3.3V 16k Bits 1R1T Phase Change Random Access Memory (PCRAM) Chip
DING Sheng, SONG Zhi-Tang, LIU Bo, ZHU Min, CHEN Xiao-Gang, CHEN Yi-Feng, SHEN Ju, FU Cong, FENG Song-Lin
State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences, Shanghai 200050
Using standard 0.18-μm CMOS process and the special platform for 8-inch phase change random access memory (PCRAM), the first Chinese 16k bits PCRAM chip has been successfully achieved. A 1R1T structure has been designed for low voltage drop and low cost compared to the 1R1D structure and the BJT-switch structure. Full integration of the 16k bits PCRAM chip, including memory cell, array structure, critical circuit module, and physical layout, has been designed and verified. The critical integration technology of the phase change material (PCM) fabrication and the standard CMOS process has been solved. Test results about PCM in a large-scale array have been generated for the next research of PCRAM chip.
Using standard 0.18-μm CMOS process and the special platform for 8-inch phase change random access memory (PCRAM), the first Chinese 16k bits PCRAM chip has been successfully achieved. A 1R1T structure has been designed for low voltage drop and low cost compared to the 1R1D structure and the BJT-switch structure. Full integration of the 16k bits PCRAM chip, including memory cell, array structure, critical circuit module, and physical layout, has been designed and verified. The critical integration technology of the phase change material (PCM) fabrication and the standard CMOS process has been solved. Test results about PCM in a large-scale array have been generated for the next research of PCRAM chip.
[1] Ovshinsky S R 1968 Phys. Rev. Lett. 21 1450 [2] Feinleib J et al 1971 Appl. Phys. Lett. 186254 [3] Lai S and Lowrey T 2001 Electron Devices Meeting IEDMTech. Dig. (Washington, DC, USA) p 3651 [4] Tom S 2005 Non-Volatile Memory Technology Symposium(Dallas, Texas, USA 7--10 November 2005) p 97 [5] Bedeschi F et al 2004 Symp. VLSI Technology Digest ofTechnical (Honolulu, USA 17--19 June 2004) p442 [6] Hwang Y N et al 2003 Symp. VLSI Technology Digest ofTechnical (Honolulu, USA 10--12 June 2003) p17 [7] Liu B and Feng G M 2007 Chin. Phys. Lett. 24262 [8] Xu C et al 2008 Appl. Phys. Lett. 92 062103 [9] Liu B et al 2005 Thin Solid Films 478 49 [10] Feng G M et al 2008 Chin. Phys. Lett. 25 2289 [11] Zhong M et al 2008 Chin. Phys. Lett. 25 762 [12] Zhang T et al 2007 Chin. Phys. Lett. 24 790 [13] Woo Y C, Cho B H, Kim K H et al 2007 ISSCC. Dig.Tech. (San Francisco, CA, USA 11-15 Feb. 2007) p293 [14] Bedeschi F, Fackenthal R, Resta C et al 2008 ISSCC.Dig. Tech. (San Francisco, CA, USA 3-7 Feb. 2008)p428 [15] Zhang T et al 2004 Chin. Phys. Lett. 21 741 [16] Liang S et al 2007 Control Automation 23 4