摘要Mechanism of thermal conductivity of nanofluids is analysed and calculated, including Brownian motion effects, particle agglomeration and viscosity, together influenced by temperature. The results show that only Brownian motion as reported is not enough to describe the temperature dependence of the thermal conductivity of nanofluids. The change of particle agglomeration and viscosity with temperature are also important factors. As temperature increases, the reduction of the particle surface energy would decrease the agglomeration of nanoparticles, and the reduction of viscosity would improve the Brownian motion. The results agree well with the experimental data reported.
Abstract：Mechanism of thermal conductivity of nanofluids is analysed and calculated, including Brownian motion effects, particle agglomeration and viscosity, together influenced by temperature. The results show that only Brownian motion as reported is not enough to describe the temperature dependence of the thermal conductivity of nanofluids. The change of particle agglomeration and viscosity with temperature are also important factors. As temperature increases, the reduction of the particle surface energy would decrease the agglomeration of nanoparticles, and the reduction of viscosity would improve the Brownian motion. The results agree well with the experimental data reported.
LI Yu-Hua;QU Wei;FENG Jian-Chao. Temperature Dependence of Thermal Conductivity of Nanofluids[J]. 中国物理快报, 2008, 25(9): 3319-3322.
LI Yu-Hua, QU Wei, FENG Jian-Chao. Temperature Dependence of Thermal Conductivity of Nanofluids. Chin. Phys. Lett., 2008, 25(9): 3319-3322.
[1] Choi U S 1995 Developments and Applications ofNon-Newtonian Flows (New York: ASME) p 99 [2] Chen H, Yang W, He Y et al 2008 Powder Technol. 183 63 [3] Xuan Y and Li Q 2003 J. Heat Trans. 125 151 [4]Zhou L P and Wang B X 2003 J. Engin. Thermophys. 24 1037 [5]Zhang L D and Mou J M 1994 Nano Materials(Shengyang: Liaoning Science and Technology Press) (in Chinese) [6]Zhou L P and Wang B X 2003 Prog. Natural Sci. 13 426 [7]Xie H Q, Xi T G 2006 J. Shanghai Second PolytechnicUniversity 23 200 [8]Xue Q Z 2003 Phys. Lett. 307 313 [9] Hwang Y J, Ahn Y C, Shin HS, Lee C G, Kim GT, Park H S andLee J K 2006 Appl. Phys. Lett. 6 1068 [10] Xuan Y M, Hu W F and Li Q 2002 Engin. Thermophys. 23 206 (in Chinese) [11] Wang B X, Zhou LP and Peng X F 2003 J. Heat Mass.Trans. 46 2655 [12] Das S K, Putra N, Thiesen P and Roetzel W 2003 J.Heat Transfer 125 567 [13] Liu W, Deng X Y and Zhang Z K 2004 Phys. Testing andChemical Analysis: Phys. Testing 4064 (in Chinese) [14] Li Q 2002 J. Engineering for Thermal Energy andPower 11 568 (in Chinese)
2008, Vol. 25 
